Patents by Inventor David E. Sigurdson

David E. Sigurdson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rigid-flex assembly for high-speed sensor module comprising a flexible wiring section with dual flexible strips stacked and attached together
    Patent number: 10410760
    Abstract: A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: September 10, 2019
    Assignee: Raytheon Company
    Inventors: Jay R. Neumann, Thomas F. McEwan, David E. Sigurdson, Alberto Perez, Janine F. Lambe, Gregory D. Tracy
  • Rigid-Flex Assembly for High-Speed Sensor Modules
    Publication number: 20170200529
    Abstract: A rigid-flex assembly (RFA) includes a circuit board attachable to a focal plane sensor. The RFA includes a flexible wiring section electrically coupled at opposing ends to the circuit board and to an edge connector. The flexible wiring section has a controlled separation distance or volume or vacuum gap between wiring strips for reduction of dielectric electrical loss and electrical cross talk. The flexible section has wires or traces configured to reduce the amount of copper used while optimizing signal integrity. Rigid substrates electrically couple the flexible wiring section to the connector. The RFA uses an end-launch, in-plane connection to the sensor for improved performance. A sensor module includes a housing and a sensor. An RFA is coupled to the sensor for high-speed data transfer and that optimizes signal integrity while providing thermal isolation via the flexible section.
    Type: Application
    Filed: June 27, 2016
    Publication date: July 13, 2017
    Inventors: Jay R. Neumann, Thomas F. McEwan, David E. Sigurdson, Alberto Perez, Janine F. Lambe, Gregory D. Tracy