Abstract: A preferred method for producing a pair of sputter targets includes the step of machining fist and second backing plates to form surfaces having near net profiles characteristic of an ion source, the sputtering material and the target shape. A preform is constructed which includes the first backing plate, a first powder layer abutting against the first backing plate, a spacer abutting against the first powder layer, a second powder layer abutting against the spacer, and the second backing plate abutting against the second powder layer. In an especially preferred form, the spacer comprises a pair of metal plates separated by a layer of bond-resistant material such as boron nitride. The preform is heated and isostatically pressed to consolidate the powder layers to form the pair of sputter targets and to diffusion bond the targets to corresponding backing plates. The method promotes the formation of uniformly even sputtering surfaces on the targets.

Abstract: Methods of preparing a sputter target or a sputter target/backing plate assembly and assemblies so prepared are disclosed. The methods comprise forming a friction weld joint consisting of a horizontal surface, an angled surface, a curved surface or any combination of the preceding. The target is rotated in the collet of a friction welding machine and the base or backing plate forced against the target to form the weld.

Abstract: Methods of preparing a sputter target/backing plate assembly and assemblies so prepared are disclosed. The methods comprise forming a plurality of grooves in one of the metal surfaces to be joined in the bonding process. The grooves are each provided in a closed, loop configuration or pattern. The target and backing plate to be bonded are adjacently positioned to form an assembly with the grooved surface forming one of the interfacial joint surfaces. The assembly is then placed in a controlled atmosphere, such as a vacuum, heated to a temperature just below the melting point of the lower melting metal to be joined, and pressed until the grooves are substantially filled with metal or alloy from the other, non-grooved interfacial surface.