Patents by Inventor David E. Swernofsky

David E. Swernofsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11852270
    Abstract: A fluid system and a blind-mate fluid fitting can be operable to allow for mating fluid system components even in the presence of angular, radial, and/or axial port misalignment. The blind-mate fluid fitting includes a shoulder and fitting portion extending from one side of the shoulder. The fitting portion defines a central fitting axis and is operable to inserted into a fluid port of a component. The fluid port defines a central port axis. The fitting portion includes a sealing portion that is operable to seal against the fluid port when the central fitting axis is positioned at a zero angle and at least one of a plurality of different non-zero angles relative to the central port axis.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: December 26, 2023
    Assignee: Raytheon Company
    Inventors: David E. Swernofsky, Robert Larson
  • Publication number: 20230036437
    Abstract: A fluid system and a blind-mate fluid fitting is provided. The blind-mate fluid fitting includes a shoulder and fitting portion extending from one side of the shoulder. The fitting portion defines a central fitting axis and is operable to inserted into a fluid port of a component. The fluid port defines a central port axis. The fitting portion includes a sealing portion that is operable to seal against the fluid port when the central fitting axis is positioned at a zero angle and at least one of a plurality of different non-zero angles relative to the central port axis.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Applicant: Raytheon Company
    Inventors: David E. Swernofsky, Robert Larson
  • Patent number: 9942975
    Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: April 10, 2018
    Assignee: RAYTHEON COMPANY
    Inventors: James M. Elliott, James S. Wilson, David E. Swernofsky
  • Patent number: 9923293
    Abstract: A connectable assembly is provided and includes a body defining a recess, a male conductive element supportively disposed proximate to the body and a conductive compliant (CC) plug disposed within the recess for establishing a radially compliant, axially free running electrical connection with the male conductive element.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: March 20, 2018
    Assignee: RAYTHEON COMPANY
    Inventors: David E. Swernofsky, Brandon W. Pillans
  • Publication number: 20170352969
    Abstract: A connectable assembly is provided and includes a body defining a recess, a male conductive element supportively disposed proximate to the body and a conductive compliant (CC) plug disposed within the recess for establishing a radially compliant, axially free running electrical connection with the male conductive element.
    Type: Application
    Filed: June 2, 2016
    Publication date: December 7, 2017
    Inventors: David E. Swernofsky, Brandon W. Pillans
  • Publication number: 20170099726
    Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
    Type: Application
    Filed: October 5, 2015
    Publication date: April 6, 2017
    Inventors: James M. Elliott, James S. Wilson, David E. Swernofsky