Abstract: As disclosed herein, an apparatus for adjusting a tension of a headband of a head-mounted display (HMD) is provided. The apparatus may include a base plate including a stationary ratchet drum. The apparatus may include a rotating cap positioned over at least the stationary ratchet drum to define an internal space therebetween. The rotating cap may include multiple walled structures projecting from an inner surface of the rotating cap and into the internal space. The apparatus may include a ratchet positioned in the internal space. The ratchet may include multiple pawls. Each pawl may include a head. The head may include a first protrusion projecting transversely to the head and a second protrusion projecting transversely to the first protrusion. The first protrusion may be received within a corresponding walled structure, and the corresponding walled structure may be configured to guide a pivoting movement of the pawl.

Abstract: As disclosed herein, an apparatus for adjusting a tension of a headband of a head-mounted display (HMD) is provided. The apparatus may include a base plate including a stationary ratchet drum. The apparatus may include a rotating cap positioned over at least the stationary ratchet drum to define an internal space therebetween. The rotating cap may include multiple walled structures projecting from an inner surface of the rotating cap and into the internal space. The apparatus may include a ratchet positioned in the internal space. The ratchet may include multiple pawls. Each pawl may include a head. The head may include a first protrusion projecting transversely to the head and a second protrusion projecting transversely to the first protrusion. The first protrusion may be received within a corresponding walled structure, and the corresponding walled structure may be configured to guide a pivoting movement of the pawl.

Abstract: A mechanism for performing thermal testing is described. The system for performing thermal testing may include a housing, a heating element and a processor. The housing is configured to be compatible with a plurality of different types of transceiver form factors. The heating element is configured to be at a location within the housing to approximate an integrated circuit chip heat source of the plurality of different types of transceiver form factors. The processor is configured to automatically conduct a thermal test and provide thermal test results.