Abstract: A process for increasing the strength of pure copper and other fcc matrix alloys while maintaining ductility. The method is particularly applicable to face-centered-cubic materials that undergo dynamic recovery when strain-hardened at room temperature. The material is first subjected to equal channel angular pressing to create an ultra fine grain structure (“UFG”). The UFG sample is then subjected to cryogenic drawing and finally to subcryogenic deformation.

Abstract: A process for increasing the strength of pure copper and other fcc matrix alloys. The method is particularly applicable to face-centered-cubic materials that undergo dynamic recovery when strain-hardened at room temperature. A cryogenic strain hardening process is used to create a high strength pure copper or copper+Al2O3 alloy. The strength of the material is substantially increased. However, the loss of conductivity is minimal. In the preferred embodiment, pure copper or a copper alloy is drawn into a wire at a temperature of about 77 K. Dynamic recovery of the material is substantially reduced. With this method, drawn copper wire exhibits a strength level about 45% higher than that achievable by an equivalent room temperature deformation.

Abstract: Electrical conductors and methods of producing them, where the conductors possess both high strength and high conductivity. Conductors are comprised of carbon steel and a material chosen from a group consisting of copper, nickel, silver, and gold. Diffusion barriers are placed between these two materials. The components of a conductor are assembled and then the assembly is subjected to heat treating and mechanical deformation steps.