Patents by Inventor David Emil Nelson

David Emil Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7335341
    Abstract: A new kinetic spray process is disclosed that enables one to secure a plurality of ceramic elements together quickly without the need for glues or other adhesives. The process finds special utilization in the formation of non-thermal plasma reactors wherein the kinetic spray process can be used to simultaneously secure the ceramic elements together and to form electrical connections between like electrodes in the non-thermal plasma reactor.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: February 26, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Thomas Hubert Van Steenkiste, Joseph V. Mantese, Bob Xiaobin Li, Pertrice Auguste Wethey, Robert Paul Johnston, David Emil Nelson
  • Patent number: 6979892
    Abstract: A method for preparing a non-thermal plasma reactor substrate includes disposing electrical vias on green stage first and second ceramic plates; filling the electrical vias with conductive material; and forming electrical contact via cover pads; disposing conductive material on the first ceramic plate to form an electrode plate having a main electrode portion and a terminal lead for electrically connecting the main electrode portion to the electrical vias; laminating the electrode plate and the second ceramic plate together, embedding the electrode therebetween; co-firing the plates to form a laminated co-fired embedded-conductor element; stacking a plurality of the laminated co-fired embedded-conductor elements to form a multi-cell stack, the filled electrical vias aligning in the stack to provide an electrical bus for connecting alternating elements in the stack; and disposing spacers with matching vias and via cover pads between adjacent pairs of elements to form exhaust gas passages.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: December 27, 2005
    Assignee: Delphi Technologies, Inc.
    Inventors: Bob Xiaobin Li, David Kwo-Shyong Chen, Joachim Kupe, David Emil Nelson
  • Patent number: 6946793
    Abstract: A non-thermal plasma reactor and method for preparing same for conversion of exhaust gas constituents is prepared from an extruded monolith comprising a plurality of conductive and exhaust channels separated by substantially planar dielectric barriers. Conductive material printed onto selected monolith channels form the conductive channels, which are connected along bus paths to form an alternating sequence of polarity, separated by exhaust channels. Conductive channels and channels not selected for exhaust flow are plugged to exclude exhaust gases and to prevent electrical leakage. During operation, exhaust gas flows through exhaust channels and is treated by the high voltage alternating current flowing through the conductive channels. The substantially planar dielectric barriers provide a uniform electrical response throughout the exhaust channels.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: September 20, 2005
    Assignee: Delphi Technologies, Inc.
    Inventor: David Emil Nelson
  • Patent number: 6887440
    Abstract: An edge-connected non-thermal plasma reactor includes an element having an edge-connected frame comprising a pair of dielectric edge connectors secured at opposite ends to a pair of outer dielectric plates. The dielectric edge connectors have a backplane and a plurality of tines protruding along one major surface of the backplane. The tines are spaced apart from one another at regular intervals so as to form pockets between adjacent tines. Alternating polarity electrode plates comprising a dielectric barrier plate having an electrode and terminal connection lead disposed on the dielectric barrier are arranged within the edge-connected frame so as to define the presence of a dielectric barrier next to a plasma cell, with the pockets engaging opposite ends of the electrode plates. Double and single dielectric edge-connected reactor elements are provided.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: May 3, 2005
    Assignee: Delphi Technologies, Inc.
    Inventors: David Emil Nelson, Bob Xiaobin Li, Tom L. Stuart
  • Patent number: 6878030
    Abstract: A non-thermal plasma reactor for conversion of exhaust gas constituents is characterized by a reactor element prepared from a curved, swept-shaped substrate specifically designed for fabrication via extrusion. The as-extruded curved substrate comprises a thick outer wall surrounding a plurality of channels separated by dielectric barriers. Selected channels are coated with a conductive material to form conductor channels. The prepared reactor element preferably comprises multiple concentric exhaust channels, multiple concentric conductor channels having alternating polarity, each connected to its respective polarity via bus paths, in-line structural support ligaments for providing optimal structural support while preventing exhaust leakage, and thick outer walls providing high crush resistance and allowing robust mounting into the reactor housing. The nested, concentric arrangement and curved shape substrate advantageously enhances the reactor's ability to adapt to fit various vehicle sizes.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: April 12, 2005
    Assignee: Delphi Technologies, Inc.
    Inventor: David Emil Nelson
  • Patent number: 6878348
    Abstract: A simplified, low cost method for preparing a non-thermal plasma reactor comprises forming cell building blocks of material having a high dielectric constant, printing a conductive print onto the cell walls, assembling the cells into a multi-cell stack, providing electrical connections for connecting said cells to a high voltage source, applying insulation to said multi-cell stack, and inserting the multi-cell stack into a non-thermal plasma reactor housing. The simplified design eliminates the need for spacers between individual cells, thus reducing the total number of components. The method employing formed shape building blocks provides flexibility and may be used in conjunction with conventional processing methods. The printing sequence is defined from the top of the multi-cell stack to the bottom, further minimizing the number of components. Use of a three-dimensional conductive print further simplifies preparation by eliminating the need for a secondary conductive print along the edge of the stack.
    Type: Grant
    Filed: March 14, 2001
    Date of Patent: April 12, 2005
    Assignee: Delphi Technologies, Inc.
    Inventors: David Emil Nelson, Mark David Hemingway, Gregory Stephen Sims
  • Patent number: 6838058
    Abstract: A non-thermal plasma reactor element includes a structural carrier; a thin electrode layer disposed upon the structural carrier; and a thin high k barrier layer disposed upon the electrode layer. Double, single and null dielectric carrier elements are provided. The structural support function for the element is substantially provided by the structural carrier while the dielectric barrier function is substantially provided by the high k barrier layer. This enables optimum utilization of conventional extrusion materials having low-cost, fabricability, mechanical and thermal properties (such as cordierite, mullite, and alumina) as structural carriers. Electrode layers and high k barrier layers are tailored to have dimensions as thin as possible for the particular NTP reactor application. In a preferred embodiment, a minimal number of structural ligaments are provided, thereby maximizing conversion efficiency while maintaining structural and electrical performance.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: January 4, 2005
    Assignee: Delphi Technologies, Inc.
    Inventor: David Emil Nelson
  • Patent number: 6821493
    Abstract: A low-loss electrode-printed structural dielectric barrier for a non-thermal plasma reactor and non-thermal plasma multi-cell stacks having low-loss electrodes. The low-loss electrode-printed structural dielectric barriers include a structural dielectric barrier having a first side and a second opposite side; a low-loss electrode pattern disposed on the second side of the structural dielectric barrier; the low-loss electrode pattern comprising first and second major electrode sections that are offset from any ribs, supports, ligaments, spacers, tines, or other structure that serves as a structural dielectric connection between dielectric barriers in a multi-cell stack, a connector disposed between and electrically connecting the first and second major electrode sections and offset relative to a centerline perpendicular to the rib orientation, and a bus path connector electrically connected to one of the major electrode sections and offset relative to the centerline.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: November 23, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: David Emil Nelson, Bob Xiaobin Li, Delbert L. Lessor
  • Patent number: 6800256
    Abstract: A scaleable inter-digitized tine non-thermal plasma reactor element includes at least one pair of inter-digitized tine end connectors connected together defining gas passages between the tines. The prepared inter-digitized tine reactor element has a scaleable height, width, and length. Connectors are defined that enable efficient non-thermal reactor element fabrication for widely varying applications having various flow throughput and constituent reduction requirements. An inter-digitized tine reactor element is provided having several zones that are selectively powered so that the effective length of the reactor can be adjusted during operation for optimal efficiency over a range of operating conditions Structural carrier connectors and structural conductor connectors are provided. Structural carrier connectors have tines defined in a side to side basis comprising a high-k dielectric layer, electrode layer, structural dielectric, electrode layer, and high-k dielectric layer.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: October 5, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: David Emil Nelson, Mark David Hemingway, Thomas W. Silvis, Bob Xiaobin Li
  • Publication number: 20040069411
    Abstract: A non-thermal plasma reactor element includes a structural carrier; a thin electrode layer disposed upon the structural carrier; and a thin high k barrier layer disposed upon the electrode layer. Double, single and null dielectric carrier elements are provided. The structural support function for the element is substantially provided by the structural carrier while the dielectric barrier function is substantially provided by the high k barrier layer. This enables optimum utilization of conventional extrusion materials having low-cost, fabricability, mechanical and thermal properties (such as cordierite, mullite, and alumina) as structural carriers. Further, since the reactor capacitance is not dependent on the thickness of the structural carrier, structural carrier thickness is selected based upon mechanical strength and durability requirements of a given system. Electrode layers and high k barrier layers are tailored to have dimensions as thin as possible for the particular NTP reactor application.
    Type: Application
    Filed: December 18, 2000
    Publication date: April 15, 2004
    Inventor: David Emil Nelson
  • Patent number: 6692704
    Abstract: A non-thermal plasma (NTP) reactor structural conductor element includes a base conductor support and a high dielectric constant (“high k”) barrier layer supported by and substantially surrounding the base conductor support to form a structural conductor NTP reactor element. The structural conductor element may comprise a variety of shapes such as plates, sheets, half-box, I shapes, C shapes, or comb shapes, among others. In one embodiment, the dielectric barrier layer includes a coating applied to the base conductor support. In another embodiment, the dielectric barrier layer includes a high k film laminated to the base conductor support. In yet another embodiment, the base conductor support integrally forms the dielectric barrier layer via conversion of surfaces of the base conductor using electrochemical, thermal or chemical means to form the dielectric barrier layer.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: February 17, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: David Emil Nelson, Bob X. Li, Mark David Hemingway, Suresh Baskaran, Joachim Kupe, Gregory Stephen Sims, Delbert L. Lessor, Carl Elmer Miller, Darrell R. Herling
  • Patent number: 6638484
    Abstract: Single dielectric barrier extruded element non-thermal plasma reactors include first and second opposing dielectric barrier layers forming an exhaust channel therebetween, the first barrier layer provided with a first polarity conductor on an interior surface thereof and the second barrier layer provided with a second polarity conductor on the exhaust channel exterior surface. The second barrier layer provides the single dielectric barrier layer. The second polarity conductor serves as a conductor on the channel interior surface of the adjacent exhaust channel in repetitive fashion. The reactors are free of dedicated conductive passages. An electrode coating pattern having conductive coating extending fully to the side walls to connect with side bus connections eliminates the need for internal bus paths. Single dielectric barrier planar and swept-shaped reactor elements have minimal or partially extending internal support ligaments providing enhanced conversion efficiency.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 28, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: David Emil Nelson, Bob Xiaobin Li, Blaine Roy Danley
  • Patent number: 6537507
    Abstract: A non-thermal plasma reactor element is provided comprising a multi-cell stack prepared from a plurality of formed building blocks of dielectric material, the walls of the building blocks defining a cell having an exhaust passage for flowing gas to be treated therethrough. A conductive print forming an electrode and connector is disposed on at least one wall of each of the cells and outer insulative plates, disposed on opposite ends of the multi-cell stack, are provided to protect the conductive print. The non-thermal plasma reactor element includes cells defined by a single structural dielectric barrier comprising a “conductor-single structural dielectric barrier-exhaust passage-conductor” arrangement, wherein individual cells of the reactor element are defined by a single structural dielectric barrier.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: March 25, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: David Emil Nelson, Bob Xiaobin Li, Mark David Hemingway, Darrell R. Herling, Suresh Baskaran
  • Publication number: 20030007907
    Abstract: A low-loss electrode-printed structural dielectric barrier for a non-thermal plasma reactor and non-thermal plasma multi-cell stacks having low-loss electrodes. The low-loss electrode-printed structural dielectric barriers include a structural dielectric barrier having a first side and a second opposite side; a low-loss electrode pattern disposed on the second side of the structural dielectric barrier; the low-loss electrode pattern comprising first and second major electrode sections that are offset from any ribs, supports, ligaments, spacers, tines, or other structure that serves as a structural dielectric connection between dielectric barriers in a multi-cell stack, a connector disposed between and electrically connecting the first and second major electrode sections and offset relative to a centerline perpendicular to the rib orientation, and a bus path connector electrically connected to one of the major electrode sections and offset relative to the centerline.
    Type: Application
    Filed: March 28, 2002
    Publication date: January 9, 2003
    Inventors: David Emil Nelson, Bob Xiaobin Li, Delbert L. Lessor
  • Publication number: 20020174938
    Abstract: A method for preparing a non-thermal plasma reactor substrate includes disposing electrical vias on green stage first and second ceramic plates; filling the electrical vias with conductive material; and forming electrical contact via cover pads; disposing conductive material on the first ceramic plate to form an electrode plate having a main electrode portion and a terminal lead for electrically connecting the main electrode portion to the electrical vias; laminating the electrode plate and the second ceramic plate together, embedding the electrode therebetween; co-firing the plates to form a laminated co-fired embedded-conductor element; stacking a plurality of the laminated co-fired embedded-conductor elements to form a multi-cell stack, the filled electrical vias aligning in the stack to provide an electrical bus for connecting alternating elements in the stack; and disposing spacers with matching vias and via cover pads between adjacent pairs of elements to form exhaust gas passages.
    Type: Application
    Filed: April 23, 2002
    Publication date: November 28, 2002
    Inventors: Bob Xiaobin Li, David Kwo-Shyong Chen, Joachim Kupe, David Emil Nelson
  • Publication number: 20020131916
    Abstract: A non-thermal plasma (NTP) reactor structural conductor element includes a base conductor support and a high dielectric constant (“high k”) barrier layer supported by and substantially surrounding the base conductor support to forma structural conductor NTP reactor element. The structural conductor element may comprise a variety of shapes such as plates, sheets, half-box, I shapes, C shapes, or comb shapes, among others.
    Type: Application
    Filed: March 19, 2001
    Publication date: September 19, 2002
    Inventors: David Emil Nelson, Bob X. Li, Mark David Hemingway, Suresh Baskaran, Joachim Kupe, Gregory Stephen Sims, Delbert L. Lessor, Carl Elmer Miller, Darrell R. Herling
  • Publication number: 20020131918
    Abstract: An edge-connected non-thermal plasma reactor includes an element having an edge-connected frame comprising a pair of dielectric edge connectors secured at opposite ends to a pair of outer dielectric plates. The dielectric edge connectors have a backplane and a plurality of tines protruding along one major surface of the backplane. The tines are spaced apart from one another at regular intervals so as to form pockets between adjacent tines. Alternating polarity electrode plates comprising a dielectric barrier plate having an electrode and terminal connection lead disposed on the dielectric barrier are arranged within the edge-connected frame so as to define the presence of a dielectric barrier next to a plasma cell, with the pockets engaging opposite ends of the electrode plates. Double and single dielectric edge-connected reactor elements are provided.
    Type: Application
    Filed: November 7, 2001
    Publication date: September 19, 2002
    Inventors: David Emil Nelson, Bob Xiaobin Li, Tom L. Stuart
  • Publication number: 20020076366
    Abstract: Extruded element non-thermal plasma reactors having a single dielectric barrier layer include a first barrier layer of a pair of opposing dielectric barrier layers forming an exhaust channel therebetween, the first barrier layer provided with a first polarity conductor on an interior surface thereof The second barrier layer of the pair of opposing barrier layers is provided with a second polarity conductor on the exhaust channel exterior surface, whereby the second barrier layer provides the single dielectric barrier layer. The second polarity conductor serves as a conductor on the channel interior surface of the adjacent exhaust channel in repetitive fashion until a reactor element of the desired size is achieved. The reactors are free of dedicated conductive passages, providing increased active exhaust channel volume compared to comparable double dielectric barrier elements.
    Type: Application
    Filed: December 19, 2000
    Publication date: June 20, 2002
    Inventors: David Emil Nelson, Bob Xiaobin Li, Blaine Roy Danley
  • Publication number: 20020076363
    Abstract: A scaleable inter-digitized tine non-thermal plasma reactor element includes at least one pair of inter-digitized tine end connectors connected together defining gas passages between the tines. The prepared inter-digitized tine reactor element has a scaleable height, width, and length. Connectors are defined that enable efficient non-thermal reactor element fabrication for widely varying applications having various flow throughput and constituent reduction requirements.
    Type: Application
    Filed: December 18, 2000
    Publication date: June 20, 2002
    Inventors: David Emil Nelson, Mark David Hemingway, Thomas W. Silvis, Bob Xiaobin Li
  • Patent number: 6368451
    Abstract: High voltage feedthrough connectors provide a means for isolating high voltage through a reactor housing while providing thermal expansion tolerance along with ease of assembly. The connectors provide an insulating body having a bore extending axially through said insulating body for housing a center conductor, a threaded shell assembly for engaging the insulating body and securing the insulating body to a NTP reactor housing, and a gas tight seal to prevent gas leaks to the center conductor. The center conductor includes a first end for contacting a high voltage source and a second end for contacting a high voltage electrode of a NTP reactor. In one embodiment, a fixed center conductor is provided. Preferably, a dome shaped tip may be provided on the bottom terminal connector for improved contact with the non-thermal plasma reactor high voltage electrode. Optionally, a compression spring is attached to the bottom terminal connector end of the fixed center conductor.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: April 9, 2002
    Assignee: Delphi Technologies, Inc.
    Inventors: David Alexander Goulette, Mark Ray McClanahan, David Emil Nelson