Patents by Inventor David Eric Wagner
David Eric Wagner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250076141Abstract: A sensor includes a housing having a body and a plurality of ports, a plurality of diaphragms each disposed in one of the ports, and a package having a substrate and a sensor die attached to the substrate. The body has a first face and an opposite second face. The ports extend from the first face of the body. The substrate is attached to the second face of the body and the sensor die is disposed in a sealed containing space defined in part by the substrate.Type: ApplicationFiled: September 1, 2023Publication date: March 6, 2025Applicant: TE Connectivity Solutions GmbHInventors: David Eric Wagner, Weijun (Davy) Xie, Vincent Wong
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Publication number: 20240302236Abstract: A sensor die includes a carrier wafer having a first cavity and a second cavity and a silicon wafer disposed on the carrier wafer. The silicon wafer has a first membrane aligned with the first cavity and a second membrane aligned with the second cavity. The silicon wafer is monolithically formed in a single piece separate from the carrier wafer and has a wafer thickness that is uniform through the first membrane and the second membrane. The first membrane is deflectable in proportion with an absolute pressure on one of a first wafer side and a second wafer side of the silicon wafer opposite the first wafer side. The second membrane is deflectable in proportion with a differential pressure between the first wafer side and the second wafer side.Type: ApplicationFiled: March 10, 2023Publication date: September 12, 2024Applicant: TE Connectivity Solutions GmbHInventors: David Eric Wagner, Jose Alfaro Perez
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Patent number: 11933683Abstract: A strain gauge includes a resistor formed of a doped silicon material, a conductive shield, and an isolation element disposed between the resistor and the conductive shield. The isolation element electrically isolates the resistor from the conductive shield.Type: GrantFiled: September 3, 2020Date of Patent: March 19, 2024Assignees: TE CONNECTIVITY SOLUTIONS GMBH, TYCO ELECTRONICS AMP KOREA CO., LTD.Inventors: David Eric Wagner, James Hoffman, Kim Young-Deok
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Publication number: 20220065715Abstract: A strain gauge includes a resistor formed of a doped silicon material, a conductive shield, and an isolation element disposed between the resistor and the conductive shield. The isolation element electrically isolates the resistor from the conductive shield.Type: ApplicationFiled: September 3, 2020Publication date: March 3, 2022Applicants: Measurement Specialties, Inc., Tyco Electronics AMP Korea Co., Ltd.Inventors: David Eric Wagner, James Hoffman, Kim Young-Deok
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Patent number: 11193842Abstract: Pressure sensor assemblies comprise a sensor body having a sensing membrane and wherein a fluid is placed in communication with the membrane to determine a fluid pressure. A support is connected with the body and includes an opening for receiving the fluid from an external source, wherein the opening is in fluid-flow communication with the membrane. The pressure sensor comprises one or more elements disposed therein configured to mitigate transmission of a fluid pressure spike to the sensing membrane. The body or the support may have a pressure mitigating element, e.g., an internal channel, for receiving the fluid from the opening and transferring it to the membrane, wherein the channel may itself be configured to provide the desired protection against fluid pressure spikes, or may be connected with another internal element to provide such protection.Type: GrantFiled: June 6, 2019Date of Patent: December 7, 2021Assignees: TE CONNECTIVITY SOLUTIONS GMBH, MEASUREMENT SPECIALTIES, INC.Inventors: Martin Pfeiffer, Predrag Drljaca, Jean-Francois Le Néal, David Eric Wagner, Schahrazède Mouaziz
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Patent number: 11118992Abstract: Pressure sensor assemblies comprise a sensor body having a membrane within the body for placement in communication with a fluid from an external source and determining a pressure of the fluid. A support is connected with the body and includes a channel extending therethrough for receiving the fluid, wherein the channel is in fluid-flow communication with the membrane. A substrate is connected with the support and comprises a channel extending therethrough for receiving the fluid from an external source. The support may be formed from a material having a coefficient of thermal expansion that is between a coefficient of thermal expansion of the support and a coefficient of thermal expansion of the external fluid source connected with the substrate. One of the substrate or the support comprises a fluid pressure mitigation feature for mitigating the transmission of a pressure spike in the fluid to protect the sensor membrane.Type: GrantFiled: June 6, 2019Date of Patent: September 14, 2021Assignees: MEASUREMENT SPECIALTIES, INC., TE CONNECTIVITY SOLUTIONS GMBHInventors: Martin Pfeiffer, Predrag Drljaca, Jean-Francois Le Néal, David Eric Wagner, Schahrazède Mouaziz
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Publication number: 20200386645Abstract: Pressure sensor assemblies comprise a sensor body having a membrane within the body for placement in communication with a fluid from an external source and determining a pressure of the fluid. A support is connected with the body and includes a channel extending therethrough for receiving the fluid, wherein the channel is in fluid-flow communication with the membrane. A substrate is connected with the support and comprises a channel extending therethrough for receiving the fluid from an external source. The support may be formed from a material having a coefficient of thermal expansion that is between a coefficient of thermal expansion of the support and a coefficient of thermal expansion of the external fluid source connected with the substrate. One of the substrate or the support comprises a fluid pressure mitigation feature for mitigating the transmission of a pressure spike in the fluid to protect the sensor membrane.Type: ApplicationFiled: June 6, 2019Publication date: December 10, 2020Applicants: TE Connectivity Solutions GmbH, Measurement Specialties, Inc.Inventors: Martin Pfeiffer, Predrag Drljaca, Jean-Francois Le Néal, David Eric Wagner, Schahrazède Mouaziz
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Publication number: 20200386641Abstract: Pressure sensor assemblies comprise a sensor body having a sensing membrane and wherein a fluid is placed in communication with the membrane to determine a fluid pressure. A support is connected with the body and includes an opening for receiving the fluid from an external source, wherein the opening is in fluid-flow communication with the membrane. The pressure sensor comprises one or more elements disposed therein configured to mitigate transmission of a fluid pressure spike to the sensing membrane. The body or the support may have a pressure mitigating element, e.g., an internal channel, for receiving the fluid from the opening and transferring it to the membrane, wherein the channel may itself be configured to provide the desired protection against fluid pressure spikes, or may be connected with another internal element to provide such protection.Type: ApplicationFiled: June 6, 2019Publication date: December 10, 2020Applicants: TE Connectivity Solutions GmbH, Measurement Specialties, Inc.Inventors: Martin Pfeiffer, Predrag Drljaca, Jean-Francois Le Néal, David Eric Wagner, Schahrazède Mouaziz