Abstract: An integrated circuit may be formed by forming a sacrificial silicon nitride feature. At least a portion of the sacrificial silicon nitride feature may be removed by placing the integrated circuit in a two-step oxidized layer etch tool and removing a surface layer of oxidized silicon from the sacrificial silicon nitride feature using a two-step etch process. The two-step etch process exposes the integrated circuits to reactants from a plasma source at a temperature less than 40° C. and subsequently heating the integrated circuit to 80° C. to 120° C. while in the two-step oxidized layer etch tool. While the integrated circuit is in the two-step oxidized layer etch tool, without exposing the integrated circuit to an ambient containing more than 1 torr of oxygen, at least a portion of the sacrificial silicon nitride feature is removed using fluorine-containing etch reagents, substantially free of ammonia.

Abstract: An integrated circuit may be formed by forming a sacrificial silicon nitride feature. At least a portion of the sacrificial silicon nitride feature may be removed by placing the integrated circuit in a two-step oxidized layer etch tool and removing a surface layer of oxidized silicon from the sacrificial silicon nitride feature using a two-step etch process. The two-step etch process exposes the integrated circuits to reactants from a plasma source at a temperature less than 40° C. and subsequently heating the integrated circuit to 80° C. to 120° C. while in the two-step oxidized layer etch tool. While the integrated circuit is in the two-step oxidized layer etch tool, without exposing the integrated circuit to an ambient containing more than 1 torr of oxygen, at least a portion of the sacrificial silicon nitride feature is removed using fluorine-containing etch reagents, substantially free of ammonia.

Abstract: An integrated circuit may be formed by forming a sacrificial silicon nitride feature. At least a portion of the sacrificial silicon nitride feature may be removed by placing the integrated circuit in a two-step oxidized layer etch tool and removing a surface layer of oxidized silicon from the sacrificial silicon nitride feature using a two-step etch process. The two-step etch process exposes the integrated circuits to reactants from a plasma source at a temperature less than 40° C. and subsequently heating the integrated circuit to 80° C. to 120° C. while in the two-step oxidized layer etch tool. While the integrated circuit is in the two-step oxidized layer etch tool, without exposing the integrated circuit to an ambient containing more than 1 torr of oxygen, at least a portion of the sacrificial silicon nitride feature is removed using fluorine-containing etch reagents, substantially free of ammonia.

Abstract: A process for forming an integrated circuit with an embedded epitaxially grown semiconductor using an epi blocking bilayer. The epi blocking bilayer comprised of a two different materials that may be etched selectively with respect to each other such as silicon nitride and silicon dioxide.

Abstract: An integrated circuit may be formed by forming a sacrificial silicon nitride feature. At least a portion of the sacrificial silicon nitride feature may be removed by placing the integrated circuit in a two-step oxidized layer etch tool and removing a surface layer of oxidized silicon from the sacrificial silicon nitride feature using a two-step etch process. The two-step etch process exposes the integrated circuits to reactants from a plasma source at a temperature less than 40° C. and subsequently heating the integrated circuit to 80° C. to 120° C. while in the two-step oxidized layer etch tool. While the integrated circuit is in the two-step oxidized layer etch tool, without exposing the integrated circuit to an ambient containing more than 1 torr of oxygen, at least a portion of the sacrificial silicon nitride feature is removed using fluorine-containing etch reagents, substantially free of ammonia.

Abstract: By providing heat dissipation elements or heat pipes in temperature critical areas of a semiconductor device, enhanced performance, reliability and packing density may be achieved. The heat dissipation elements may be formed on the basis of standard manufacturing techniques and may be positioned in close proximity to individual transistor elements and/or may be used for shielding particular circuit portions.

Abstract: A system and method for electronic purchasing via a mobile web-enabled communication device. A contacts list containing shipping addresses, and a payment file containing encrypted credit card information for one or more credit cards is stored on the mobile device. In response to a request for credit card and shipping information from a merchant website for an item to be purchased, a specific one of the credit cards and a specific one of the shipping addresses is selected from the contacts list and the payment file, respectively. The credit card data for the selected credit card is decrypted, and the decrypted credit card data and the selected shipping address are sent to the merchant website for order processing.

Abstract: By providing heat dissipation elements or heat pipes in temperature critical areas of a semiconductor device, enhanced performance, reliability and packing density may be achieved. The heat dissipation elements may be formed on the basis of standard manufacturing techniques and may be positioned in close proximity to individual transistor elements and/or may be used for shielding particular circuit portions.

Abstract: A plurality of content providers provide multiple resources to multiple clients. At least some of the resources are to be served to clients from a shared content delivery network (CDN) formed by a plurality of repeater servers. Each content provider provides at least some resources via one or more content sources associated with that content provider. Transmission data rates from the CDN on behalf of some of the content providers are monitored. Based at least in part on the monitored data rates, requests for resources are directed to a source other than the CDN. Redirection of requests may be based on a pricing policy.

Abstract: A framework operative in a computer network in which users of client processors connect to a content server, wherein processors in the network communicate with each other using a TCP/IP communication protocol. The framework includes a set of content servers, distinct from the content provider server, for hosting at least some of the data files that are normally hosted by the content provider server. In response to requests for a data file, generated by one of the client machines, the particular data file is served from one of the content servers having been selected based at least in part on a measure of availability of at least one of the servers of the network of servers.

Abstract: A method of distributing a data item to a plurality of computers in a network of computers. A data item is divided into a plurality of segments. Each segment is stored on at least one computer in said network. A list of computers onto which each of said segments has been stored is maintained. When a data item is requested, its component segments are obtained from at least two computers in the network. Some of the computers may form a peer-to-peer network.

Abstract: Access to and delivery of licensed content is controlled using content names that were determined based on the content. A name for a data item is obtained, the name having been determined based at least in part on the data which comprise the contents of the data item. Access to the data item is authorized based at least in part on the name. Once authorized, access may be granted from more than one computer. The name may have been determined using a hash or message digest function such as MD4, MD5 or SHA. The data item may comprise a file, a portion of a file, a page in memory, a digital message, a digital image, a video signal or an audio signal.

Abstract: Similarity of data items is determined by analyzing corresponding segments of the data items. A function is applied to each segment of a data item and the output of that function is compared to the output of the same function applied to a corresponding segment of another data item. A function may be applied to the output of the functions. The functions may be hash or message digest functions.

Abstract: A method for delivering resources to clients in a distributed computing environment. At least a first resource associated with a first content provider and maintained on an origin server references a second resource. The second resource is associated with a network formed by a plurality of repeater servers operable to serve the second resource to clients on behalf of the first content provider, the origin server being distinct from the plurality of repeater servers. Responsive to a request that causes the first resource to be served to a client from the origin server, at least one of the plurality of repeater servers is selected to serve the second resource to the client. If a copy of the second resource is available on the selected repeater server, the copy of the second resource is served to the client from the selected repeater server; otherwise, if a copy of the second resource is not available on the selected repeater server, the second resource is replicated on the selected repeater server.

Abstract: A method of processing requests for resources in a system in which a plurality of content providers provide multiple resources. Content providers offload the serving of some of their resources to a shared content delivery network (CDN) formed by a plurality of servers. The CDN is shared among the content providers. Some of a content provider's content may be served from an origin server associated with that content provider, while requests for other content from that content provider are served from the shared CDN. Requests for content are directed to servers in the CDN based on load conditions on the CDN servers and network conditions.

Abstract: A method of generating a web page modifies uniform resource locators (URLs) of embedded resources in a web page. The modified URLs include data prepended to information from the original URLs. The prepended data may be a hostname or an network address that is resolvable to a shared network of servers.

Abstract: A method of processing requests for resources in a system in which a plurality of content providers provide multiple resources. Content providers offload the serving of some of their resources to a shared content delivery network (CDN) formed by a plurality of servers. The CDN is shared among the content providers. Some of a content provider's content may be served from an origin server associated with that content provider, while requests for other content from that content provider are served from the shared CDN.

Abstract: A plurality of data items are distributed across a plurality of computers, some of which may form a peer-to-peer network. A first computer receives a request for a data item from a requesting computer. The request includes a True Name of the data item. The first computer causes the requesting computer to obtain the data item from a second computer, distinct from the first computer. The first computer may not have a copy of the requested data item. The first computer may know the location of the data item. The first computer may forward the request for the data item to at least one other computer.

Abstract: Resource requests made by clients of origin servers in a network are intercepted by reflector mechanisms and selectively reflected to other servers called repeaters. The reflectors select a best repeater from a set of possible repeaters and redirect the client to the selected best repeater. The client then makes the request of the selected best repeater. The resource is possibly rewritten to replace at least some of the resource identifiers contained therein with modified resource identifiers designating the repeater instead of the origin server.

Abstract: The present invention provides an interconnect structure, a method of manufacture therefore, and a method for manufacturing an integrated circuit including the same. The method for forming the interconnect structure, among other steps, includes subjecting a first portion (510) of a substrate (220) to a first etch process, the first etch process designed to etch at a first entry angle (?1), and subjecting a second portion (610) of the substrate (220) to a second different etch process, the second different etch process designed to etch at a second lesser entry angle (?2).