Patents by Inventor David Ferreres

David Ferreres has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices for Restoring Blood Flow and Embolus Removal During Acute Ischemic Stroke
    Publication number: 20090292297
    Abstract: Briefly stated, improved processes and devices restore blood flow to permit auto-lysis of clots, or enable capture emboli in their entirety without fragmenting while arterial access is maintained, preserving the integrity of patients' vasculature.
    Type: Application
    Filed: May 29, 2009
    Publication date: November 26, 2009
    Inventor: David Ferrere
  • Electrostatic device for holding an electronic component wafer
    Patent number: 7133273
    Abstract: A device for holding a wafer, an electronic component comprises a system for transporting without deformation a wafer of electronic components. The device also enables the transport by one or the other of the passive or active faces. The device comprises a planar and thin rigid support having a controllable temperature and at least an electrode consisting of (N+1) elements, confined between two sheets of insulating material. The support provides a protrusion-free surface for gripping the wafer, and electrostatic elements for positive retention of the wafer induces a gripping power of the latter distributed over the entire support. The U-shaped support is borne by the electrical bond of the electrode with a remote (adjustable, AC or DC, mono-multipolar) power source. The gripping surface of the device is planar and protrusion-free whatever the geometry of the support used.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: November 7, 2006
    Assignee: Semco Engineering SA
    Inventor: David Ferreres
  • Electrostatic device for holding an electronic component wafer
    Publication number: 20040070914
    Abstract: A device for holding a wafer, an electronic component comprises a system for transporting without deformation a wafer of electronic components. The device also enables the transport by one or the other of the passive or active faces. The device comprises a planar and thin rigid support having a controllable temperature and at least an electrode consisting of (N+1) elements, confined between two sheets of insulating material. The support provides a protrusion-free surface for gripping the wafer, and electrostatic elements for positive retention of the wafer induces a gripping power of the latter distributed over the entire support. The U-shaped support is borne by the electrical bond of the electrode with a remote (adjustable, AC or DC, mono-multipolar) power source. The gripping surface of the device is planar and protrusion-free whatever the geometry of the support used.
    Type: Application
    Filed: November 5, 2003
    Publication date: April 15, 2004
    Inventor: David Ferreres