Abstract: Methods and an apparatus are disclosed for providing enhanced vibration immunity in a solder paste inspection system, although they are usable in any number of industries that require rapid acquisition of several images. The method includes capturing at least three images on a frame transfer CCD array before any data is sequentially read from the array. The present method is extendable to a larger number of images. Additionally, the masked memory area can be larger than the image area of the frame transfer CCD array.

Abstract: The system of the present invention reports a signal related to a physical condition of an object, such as an electronic component, with the most basic realization of the system including a vacuum quill for releasably holding the object and a motion control system for rotating the quill. The invention includes control electronics coupled to the detector for providing a trigger signal where the detector is oriented to view a stripe in a viewing plane perpendicular to the central axis of the quill, and to provide an image of the stripe. The control electronics sends a plurality of trigger signals to the detector while the motion control system rotates the quill, with each trigger signal triggering the acquisition of another image of a stripe.

Abstract: A high-speed image acquisition system includes a source of light; a sensor for acquiring a plurality of images of the target; a system for determining relative movement between the source and the target; and an image processor for processing the acquired images to generate inspection information relative to the target. The system has an extended dynamic range provided by controlling illumination such that the plurality of images is acquired at two or more different illumination levels. In some embodiments, the high-speed image acquisition system is used to perform three dimensional phase profilometry inspection.

Abstract: An automated system includes improved height sensing. In one aspect, a on-head camera performs the dual functions of fiducial imaging and height sensing using an auxiliary off-axis light source and triangulation. In another aspect, an on-head height sensor is positioned to measure height at a location that is not beneath any nozzles. The sensor provides height information at a plurality of locations over the board, and a height map of the board is created. In yet another aspect of the invention, the above features are combined to provide an on-head camera that images fiducials and measures height at a plurality of locations such that a height map is created.

Abstract: A computer implemented software device for estimating background tilt and offset is disclosed to preferably be adaptable to an optical measurement instrument wherein the estimated parameters are resolved to generate a reference plane to be subtracted from a height map of a phase profile. A set of histograms of heights is used to develop a merit function. A two-dimensional high speed iterative search is used to optimize the merit function to generate a reference plane coincident with the spatial tilt of the phase profile. The invention enables real-time measurement of substrate height for preferred use in high-speed image processing operations relating to circuit-board production lines.

Abstract: an optical system for computing a height of a target on a surface includes a light projector for projecting light. The light passes through a patterned reticle and a projector lens so as to illuminate the target with an image of the pattern. The light is projected telecentrically between the reticle and the projector lens, and a camera is positioned along a receive optical path. The camera receives an image of the target through a receive lens. The target and the pattern move at least three times with respect to each other, and the camera acquires an image of the object at each of at least three positions.

Abstract: The present invention includes a system for providing a signal related to a physical condition of an object, such as an electronic component. Various types of electronic components may be used with the present invention, including leaded components, column, pin or grid array packages, and the like. The system includes a quill for releasably holding the object. The object has a major surface defining a plane, and a motion control system for rotating the quill about a central axis. Control electronics in the invention provide a plurality of trigger signals to each of two detectors, each detector adapted to view the same stripe in the plane upon receipt of a trigger signal and to output an image of the stripe. The detectors view a plurality of stripes while the motion control system rotates the quill, and the output from the detectors is received by processing circuitry for processing the plurality of images of the stripes to provide the signal related to the physical condition of the object.

Abstract: A computer implemented software device for estimating background tilt and offset is disclosed to preferably be adaptable to an optical measurement instrument wherein the estimated parameters are resolved to generate a reference plane to be subtracted from a height map of a phase profile. A set of histograms of heights is used to develop a merit function. A two-dimensional high speed iterative search is used to optimize the merit function to generate a reference plane coincident with the spatial tilt of the phase profile. The invention enables real-time measurement of substrate height for preferred use in high-speed image processing operations relating to circuit-board production lines.

Abstract: An apparatus for three dimensional imaging using multi-phased structured light. Measurement of dimensions as small as two hundred microns within one percent accuracy is possible, and multiple scans of a target object, such as the solder pads on an electronic circuit board substrate, are not required. A light source, having a pair of synchronized lamps and a specially designed reticle, projects two different phases of structured light onto a target object. The two phases are projected nearly instantaneously, and the detector is able to discriminate between the two exposures presented by the two out of phase illuminations. The method for presenting the three dimensional image uses filtering techniques and certain assumptions to resolve intensity equations having three unknowns from the two exposures of out of phase structured light.

Abstract: A high speed, high precision laser-based semiconductor lead measurement system for use on surface mount component placement machines. A multi-beam laser system is used to accurately sense the position and condition of each of the many leads used on integrated circuits prior to their placement on a surface mount circuit board by a pick and place machine. Using two, three or four laser beams, the non-contact sensor system can, with the highest degree of resolution, determine lateral orientation, height, colinearity, and coplanarity of leads for integrated circuit components, even those having an ultra-fine pitch. Determination of the lead position by the invention is based on the integrated circuit leads occluding the light of one or more precisely directed and focused laser light sources. Each integrated circuit lead is passed nominally through the focal point of a laser beam. The position of each lead is determined when it blocks all or a portion of the light of the laser beam.