Abstract: This invention relates to a process for manufacturing nanowire structures, the process comprising the following steps: manufacture of a thin semiconductor film (1) extending between a first terminal (4) and a second terminal (5), and passage of a current between the first and the second terminals so as to form at least one continuous overthickness (R1, R2, R3) in the thin semiconductor film by migration of a fraction of the semiconductor material, under the action of the current, the continuous overthickness being formed along the direction of the current that passes through the film.

Abstract: This invention relates to a process for manufacturing nanowire structures, the process comprising the following steps: manufacture of a thin semiconductor film (1) extending between a first terminal (4) and a second terminal (5), and passage of a current between the first and the second terminals so as to form at least one continuous overthickness (R1, R2, R3) in the thin semiconductor film by migration of a fraction of the semiconductor material, under the action of the current, the continuous overthickness being formed along the direction of the current that passes through the film.

Abstract: A method produces a microstructure comprising an island of material confined between two electrodes forming barriers, the island (30) of material having lateral flanks running parallel to and lateral flanks running perpendicular to the barriers, wherein the lateral flanks of the island are defined by etching of at least one layer (16), called the template layer, and the barriers are formed by damascening. The method includes (a) a first etching of the template layer using a first etching mask having at least one filiform part, and (b) a second etching of the template layer, subsequent to the first etching, using a second etching mask also having at least one filiform part, oriented in a direction forming a non-zero angle with a direction of orientation of the filiform part of the first mask, in the vicinity of the site of formation of the island.

Abstract: This invention relates to a process for a manufacturing a Coulomb blockade transistor. The process comprises the following steps in sequence: deposition on an insulating substrate of a source layer, a tunnel-insulating layer and an alternating stack of at least one conducting layer and at least one insulating layer, a first etching of the stack to form a filiform tab, coating of the filiform tab with an electrically insulating coating material, a second etching of the tab of the stack to form a pillar, the second etching preserving the coating material to define a groove on each side of the pillar, the formation of at least one isolated grid in the groove, and the formation of a drain in contact with one end of the pillar opposite the source layer, through at least one tunnel-insulating layer.

Abstract: This invention relates to a Coulomb blockade transistor comprising the following on a substrate:

Abstract: The invention relates to a method for producing a microstructure comprising an island (30) of material confined between two electrodes (32) forming barriers; the island of material having lateral flanks running parallel and perpendicular to the barriers, characterized in that the lateral flanks of the island are defined by etching of at least one layer (16), called the template layer, and the barriers are formed by damascening.