Abstract: Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.

Abstract: Laminated articles and layered articles, for example, low alkali glass and/or low sodium laminated articles and layered articles useful for, for example, photovoltaic devices are described.

Abstract: Laminated articles and layered articles, for example, low alkali glass laminated articles and layered articles useful for, for example, electrochromic devices are described.

Abstract: Methods and apparatus for producing a touch sensitive LCD employing a semiconductor on glass (SiOG) structure provide for: a glass or glass-ceramic substrate; a single crystal semiconductor layer bonded to the glass or glass-ceramic substrate; display circuitry including a plurality of thin-film transistors disposed on the single crystal semiconductor layer and forming a matrix of display pixels; display control circuitry operable to drive the display circuitry to produce viewable images; and sensing circuitry operable to detect electrical characteristic changes in one or more of the single crystal semiconductor layer and the display circuitry, the electrical characteristic changes resulting from user touch events.

Abstract: Photovoltaic devices include an insulator structure bonded to an exfoliation layer, preferably of a substantially single-crystal donor semiconductor wafer, and at least one photovoltaic device layer, such as a conductive layer. In a preferred embodiment, a device may include a conductive layer adjacent to the insulator substrate and integral to the exfoliation layer, near the side that faces the insulator substrate, such as between the insulator substrate and the exfoliation layer. In a further preferred embodiment, a device may include a plurality of photovoltaic device layers distal to the insulator substrate and in or on the exfoliation layer, preferably having been epitaxially grown on the exfoliation layer after the exfoliation layer has been anodically bonded to the insulator substrate by means of electrolysis.

Abstract: Systems and methods of production of a photovoltaic device include creating on a donor semiconductor wafer an exfoliation layer and transferring the exfoliation layer to an insulator substrate. One or more finishing processes may be performed before and/or after transferring the exfoliation layer, such as to create a plurality of photovoltaic structure layers. Production of the photovoltaic device further may include subjecting the donor semiconductor wafer to an ion implantation process to create the exfoliation layer, bonding the exfoliation layer to the insulator substrate, and separating the exfoliation layer from the donor semiconductor wafer. Transferring may include forming an anodic bond via electrolysis, such as through the application of heat, pressure and voltage to the exfoliation layer and the insulator structure.