Abstract: An abatement apparatus includes a combustion chamber formed by a foraminous sleeve defining an upstream portion of the combustion chamber for treating an effluent stream, the upstream portion of the combustion chamber having an inlet for receiving the effluent stream and a wetted sleeve fluidly coupled with foraminous sleeve, the wetted sleeve defining a downstream portion of the combustion chamber, wherein the foraminous sleeve is configured to provide a foraminous axial surface facing downstream towards the downstream portion of the combustion chamber. In this way, the foraminous surface not only faces inwards towards the upstream portion of the combustion chamber, but also faces downstream, towards the downstream portion of the combustion chamber.

Abstract: A modular abatement apparatus is for abatement of an effluent stream from a semiconductor processing tool and comprises: a housing defining a common housing chamber; a plurality of combustion chamber modules positionable within the common housing chamber for treating the effluent stream, each combustion chamber module containing a foraminous sleeve defining a combustion chamber therewithin. In this way, multiple combustion chambers may be provided within a single, common housing, each of which may be configured to treat a particular effluent stream flow. Accordingly, the number of combustion chambers can be selected to match the different types and flowrates of the effluent stream expected from any particular processing tool. This provides an architecture which is readily scalable to suit the needs of different effluent gas stream types and flowrates while retaining a common housing which may interface with upstream and downstream components.

Abstract: The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C2F6) and tetrafluoromethane (CF4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH4) and tetraethoxysilane (Si(OC2H5)4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems.

Abstract: The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C2F6) and tetrafluoromethane (CF4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH4) and tetraethoxysilane (Si(OC2H5)4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems.

Abstract: The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C2F6) and tetrafluoromethane (CF4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH4) and tetraethoxysilane (Si(OC2H5)4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems.