Patents by Inventor David Frederick Diefenderfer

David Frederick Diefenderfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
    Patent number: 6171873
    Abstract: A method is described by which the mechanical strength of chips of semiconductor devices can be controlled by appropriate wafer finishing and sorted by knowledge of the finishing method and chip and wafer geometry. The control and sorting derive from a knowledge of the geometry of the striations remaining on the back of chips after the wafer-grinding finishing step.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: January 9, 2001
    Assignee: International Business Machines Corporation
    Inventors: Ronald Lee Mendelson, Robert Francis Cook, David Frederick Diefenderfer, Eric Gerhard Liniger, John M. Blondin, Donald W. Brouillette
  • Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
    Patent number: 5888838
    Abstract: A method is described by which the mechanical strength of chips of semiconductor devices can be controlled by appropriate wafer finishing and sorted by knowledge of the finishing method and chip and wafer geometry. The control and sorting derive from a knowledge of the geometry of the striations remaining on the back of chips after the wafer-grinding finishing step.
    Type: Grant
    Filed: June 4, 1998
    Date of Patent: March 30, 1999
    Assignee: International Business Machines Corporation
    Inventors: Ronald Lee Mendelson, Robert Francis Cook, David Frederick Diefenderfer, Eric Gerhard Liniger, John M. Blondin, Donald W. Brouillette