Abstract: Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.

Abstract: Examples of runtime drive detection and configuration are disclosed. In one example implementation according to aspects of the present disclosure, a computer implemented method includes detecting, by a computing system, that a drive is connected to the computing system during a runtime using a sideband signal of the drive. The method further includes determining, by the computing system, a drive type for the drive. Additionally, the method includes configuring, by the computing system, during a runtime, a PCIe multiplexer based on the determined drive type.

Abstract: A computer system includes a memory module. The memory module includes volatile memory, a non-volatile memory subsystem, a host port, and a dual-port buffer device. The dual-port buffer device synchronously couples the non-volatile memory subsystem and the host port to the volatile memory. The dual port buffer device includes routing logic to selectably route address information provided by the host port and the non-volatile memory subsystem to the volatile memory.

Abstract: An apparatus includes a memory module, and the memory module includes a package. The package contains memory dies, and the memory dies share a chip select line.

Abstract: A system includes a hybrid memory module. The hybrid memory module includes volatile memory and non-volatile memory. The system further includes a processor coupled to the hybrid memory module. The processor prevents the hybrid memory module from being mapped during a memory initialization routine by misrepresenting a status of the hybrid memory module.

Abstract: An apparatus includes a hybrid memory module, and the hybrid memory module includes volatile memory and non-volatile memory. Data is prearranged in the volatile memory. The data is committed to the non-volatile memory, as prearranged, in a single write operation when a size of the prearranged data reaches a threshold.

Abstract: The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

Abstract: The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.