Patents by Inventor David GADER

David GADER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
    Publication number: 20260011470
    Abstract: Assemblies for terminating shielded cables to printed circuit boards are described. An example assembly includes a printed circuit board (PCB), a cable having a signal conductor and a shield layer surrounding the signal conductor, and a conductive strap. The conductive strap includes a top conductive element, a bottom conductive element, and a plurality of legs between the top conductive element and the bottom conductive element. The top conductive element includes a top notch, and the bottom conductive element includes a bottom notch. The assembly also includes a top solder element positioned between the top notch and the shield layer of the cable and a bottom solder element positioned between the bottom notch and the PCB.
    Type: Application
    Filed: September 15, 2025
    Publication date: January 8, 2026
    Inventors: Jared D. Sullivan, Michael Mcgee, Eran J. Jones, David Gader, Andrew J. Wehrli, Todd D. Ward, Gianni R. Bardella, Ayman Isaac, Darian Schulz
  • Multi-layered, shielded and grounded cables and related methods
    Patent number: 12431264
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: September 30, 2025
    Assignee: Molex, LLC
    Inventors: Jared D. Sullivan, Michael Mcgee, Eran J. Jones, David Gader, Andrew J. Wehrli, Todd D. Ward, Gianni R. Bardella, Ayman Isaac, Darian Schulz
  • Multi-layered, shielded and grounded cables and related methods
    Patent number: 11735338
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: August 22, 2023
    Assignee: Molex, LLC
    Inventors: Jared D. Sullivan, Michael McGee, Eran J. Jones, David Gader, Andrew J. Wehrli, Todd D. Ward, Gianni R. Bardella, Ayman Isaac, Darian Schulz
  • MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
    Publication number: 20220384069
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Applicant: Molex, LLC
    Inventors: Jared D. SULLIVAN, Michael MCGEE, Eran J. JONES, David GADER, Andrew J. WEHRLI, Todd D. Ward, Gianni R. BARDELLA, Ayman ISAAC, Darian SCHULZ
  • MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
    Publication number: 20210217541
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 15, 2021
    Applicant: Molex, LLC
    Inventors: Jared D. SULLIVAN, Michael MCGEE, Eran J. JONES, David GADER, Andrew J. WEHRLI, Todd D. Ward, Gianni R. BARDELLA, Ayman ISAAC, Darian SCHULZ