Abstract: A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.

Abstract: A probe card for testing dies of a substrate during a wafer sort process includes a printed circuit board (PCB) and a test site arranged to connect respectively to one of the dies during a test cycle. The test site includes a first pin connecting band and a first pin set. The first pin connecting band is connected to the PCB. The first pin set is connected to the first pin connecting band and includes a pin configuration for a testing device to perform a first type of test on a first die. The test site includes only pins in the first pin set. A number of pins in the first pin set is less than a number of pins used to perform a second type of test on the first die. The second type of test is performed at a slower processing speed than the first type of test.

Abstract: Embodiments of the present disclosure provide an apparatus configured to engage a device for testing the device via automatic test equipment. The apparatus includes a heat sink, wherein the heat sink comprises a plurality of fins extending from the heat sink, and wherein the heat sink is configured to engage the device. The apparatus further includes a heat conduction layer coupled to the heat sink, a first leg coupled to the heat conduction layer, and a second leg coupled to the heat conduction layer. The second leg is spaced apart from the first leg. A vacuum path is defined through (i) the heat conduction layer and (ii) the heat sink. The vacuum path permits the apparatus to engage the device to be tested by the automatic test equipment.

Abstract: Embodiments of the present disclosure provide an apparatus configured to engage a device for testing the device via automatic test equipment. The apparatus includes a heat sink, wherein the heat sink comprises a plurality of fins extending from the heat sink, and wherein the heat sink is configured to engage the device. The apparatus further includes a heat conduction layer coupled to the heat sink, a first leg coupled to the heat conduction layer, and a second leg coupled to the heat conduction layer. The second leg is spaced apart from the first leg. A vacuum path is defined through (i) the heat conduction layer and (ii) the heat sink. The vacuum path permits the apparatus to engage the device to be tested by the automatic test equipment.

Abstract: An improved method for transferring a semiconductor carrier tray is disclosed. The method herein provides for transferring a semiconductor carrier tray from a first location to a second location by first positioning a cap member to cover the mouth of at least one cup of a semiconductor carrier tray. The capping member contacts the uppermost surface of the cup wall. A partial vacuum is applied to the capped cup, and atmosphere is evacuated from the capped cup, adhering the semiconductor tray to the capping member. Movement of the capping member causes movement of the carrier tray from a first location to a second location. When the carrier tray has been positioned at its final destination, the vacuum is released causing separation of the carrier tray and the capping member. A vacuum cap apparatus is also disclosed.