Abstract: A mobile machine comprising an object to be driven, an electric storage, an electric motor connected to the electric storage, a hydraulic pump driven by the electric motor, a hydraulic piston assembly hydraulically connected to the pump and comprising a housing having a first chamber, a second chamber, a piston separating the first and second chambers, and an actuating rod connected to the piston and the object to be driven, the hydraulic piston assembly configured to actuate the object to be driven relative to the mobile machine within a range of motion, and wherein actuation of the object to be driven relative to the body portion of the mobile machine within the range of motion is controllable by the electric motor and powered via the electric storage.

Abstract: A subsurface safety valve actuation system in well tubing comprising a safety valve, piston assembly, motor, pump, spring, reservoir, first valve, and second valve configured to provide pressure in a chamber of the piston assembly that drives the safety valve to an open position, retain pressure in the chamber that retains the safety valve in the open position, release pressure in the chamber via a first hydraulic release path and/or a second hydraulic release path between the chamber and the reservoir that extends through the first valve and second valve, respectively, and the first and second hydraulic release paths being independent from each other, whereby pressure in the chamber that retains the safety valve in the open position may be released via the first or second hydraulic release path when there is a fault in the other of the first or second release path.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: A subsurface safety valve actuation system in well tubing comprising a safety valve, piston assembly, motor, pump, spring, reservoir, first valve, and second valve configured to provide pressure in a chamber of the piston assembly that drives the safety valve to an open position, retain pressure in the chamber that retains the safety valve in the open position, release pressure in the chamber via a first hydraulic release path and/or a second hydraulic release path between the chamber and the reservoir that extends through the first valve and second valve, respectively, and the first and second hydraulic release paths being independent from each other, whereby pressure in the chamber that retains the safety valve in the open position may be released via the first or second hydraulic release path when there is a fault in the other of the first or second release path.

Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: An electro-hydraulic piston pump system comprising an electric motor (16), first and second hydraulic piston pumps (30,60), a first hydraulic actuator (90) having a first port (93) connected directly to a first port (48) of the first pump and a second port (94) connected directly to a second port (49) of the first pump, a second hydraulic actuator (100) having a third port (103) connected directly to a third port (78) of the second pump and a fourth port (104) connected directly to a fourth port (79) of the second piston pump, wherein an external force applied to the first hydraulic actuator (90) that provides a negative pressure differential to the first pump applies an assistive torque to a common motor shaft (18) driving both the first pump (30) and the second pump (60), and an external force applied to the first and second actuators (90,100) that provides a summed negative pressure differential to the first and second pumps (30,60) recharges a power supply for the motor (16).

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores. Methods of manufacturing printed circuit board assemblies utilizing carrier assemblies are also provided.

Abstract: An intelligent forecasting system that includes sources of financial and non-financial input data and a user interface generator for generating user interfaces having window elements that display the input data. The window element includes a persistent navigation pane element having vertically stacked actuatable navigation soft buttons for accessing one or more portions of an intelligent forecasting. The navigation soft buttons include, among other buttons, an Outlier Treatment soft button for processing the input data by applying thereto a statistical processing model to detect outliers in the input data, a Model Selection soft button for selecting a statistical forecasting model to apply to the input data, a Signal Explorer soft button for selecting a signal transformation method for transforming the input data, a Model Prediction soft button for selecting one of the statistical forecasting models to apply to the input data, and a Simple Prediction soft button for automatically generating forecasts.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: An In-Mold Electronics (IME) device and method of manufacturing the IME device introduce a stretchable substrate laminated to a thermoplastic layer. The stretchable substrate has a screen printable surface for receiving printed conductive interconnects. This combination enables formation of an IME device with conductive interconnects oriented for hard to reach cavities and areas. The IME device eliminates the need to have additional mold features to enable deeper drawn cavities.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: A method of manufacturing a part includes printing a layer of 3D printable material, positioning a layer of interlay material on the layer of 3D printable material, and printing another layer of 3D printable material on the layer of interlay material. A manufactured part includes a base layer of 3D printable material and a plurality of pairs of alternating layers disposed on the base layer of 3D printable material. Each pair of the plurality of pairs includes a layer of interlay material and another layer of 3D printable material printed on the layer of interlay material. The layers of interlay material provide at least one property to the manufactured part not provided by the layers of 3D printable material.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.