Abstract: Example systems and methods of a system for mounting a grinder/polisher sample holder are provided. The system includes a platform having one or more fasteners, upon which one or more mounting fixtures are arranged and mounted. The one or more mounting fixtures are configured to secure a sample holder in place for testing of the samples, such as a hardness test. One or more of the mounting fixtures may include mounting brackets to support the sample holder, and to fix an orientation and/or position of the sample holder. In examples, the mounting fixtures have interfaces to contact and support the sample holder when the sample holder is arranged within the system.

Abstract: A test panel assembly is configured to be used with multiple tests for a single component. The test panel assembly may include a main body, a first test section formed on the main body, and a second test section formed on the main body. The first test section is configured for a first test, and the second test section is configured for a second test that differs from the first test.

Abstract: A test panel assembly is configured to be used with multiple tests for a single component. The test panel assembly may include a main body, a first test section formed on the main body, and a second test section formed on the main body. The first test section is configured for a first test, and the second test section is configured for a second test that differs from the first test.

Abstract: A test panel assembly is configured to be used with multiple tests for a single component. The test panel assembly may include a main body, a first test section formed on the main body, and a second test section formed on the main body. The first test section is configured for a first test, and the second test section is configured for a second test that differs from the first test.

Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.