Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: Provided are methods, systems, and apparatuses related to modular electronics platforms for mobile computing devices. One such apparatus may include a system on module (SOM) having a first surface that is configured to be coupled electrically to one or more chipsets. The apparatus may include a land grid array (LGA) disposed on a second surface of the SOM. The LGA may include one or more center anchor pads, one or more corner anchor pads, a digital signal array, one or more communications pads, and one or more ground pads. The various pads of the LGA may be configured to be coupled to one or more pads or pins disposed on a surface of a main logic board (MLB).

Abstract: A handle assembly for a portable electronic device includes a handle attached to the electronic device and a trigger projecting from the handle. A replaceable trigger switch is selectively, mechanically retained by the handle, allowing simple replacement of the switch. In a first embodiment, the switch is located within a rechargeable battery pack, and the battery pack is removably retained within the handle. In a second embodiment, the replaceable trigger switch is retained within a trigger frame, and the trigger frame is removably retained within the handle.

Abstract: A sealable, latchable door assembly for use with a hand-held, portable electronic device that has a housing adapted to removably receive a memory card in a receiving chamber through an opening. The door assembly includes a door shaped and sized to removably cover and seal the opening in the housing to retain and protect the memory card. The door has an engaging face adapted to sealably engage the housing around the opening. A connecting member attached to the door is slidably mounted within the housing to allow the door assembly to be slid between an extended, disengaged position and a retracted position with the door in a closed, sealed position. A latch attached to the door is adapted to releasably engage the housing to secure the door in the closed, sealed position. A hinge connected between the door and the connecting member enables the door to be pivoted downward to an open position to allow uninhibited passage of the memory card through the opening in the housing.

Abstract: A latching system for a battery pack of a hand-held, portable electronic device. A primary latch on the front panel of the battery pack releasably engages a retaining shoulder portion within a battery housing to removably secure the battery pack in a fully installed, electrically connected position within the electronic device. Secondary latches are connected to the left and right side panels of the battery pack at a position away from the primary latch. Each secondary latch is adapted to releasably engage a secondary retaining shoulder within the housing to retain the battery pack in a partially removed position. Elongated electrical contacts are connected to the battery pack and provide electrical contact between the battery pack and the electronic as battery pack is moved from the installed position to the partially removed position. A switch coupled to the battery pack detects movement of the battery pack from the installed position.