Abstract: A loudspeaker having a cylindrical sound-producing membrane includes an acoustic lens which radially surrounds the membrane. The membrane is composed of wire mesh formed into a cylinder. The cylindrical membrane is positioned on the magnet structure by an inner supporting cylindrical core column. Sound from the membrane is fractionally redirected by the lens which is centered along the axis of the membrane. The lens includes a plurality of radially disposed petals that reflect a portion of the sound. The base of the lens supports and mounts the loudspeaker magnet and driver assembly.

Abstract: A method is provided for processing the back side of a semiconductor wafer after the wafer has been lapped. The process includes grinding the back side of the wafer to remove wafer material, to substantially eliminate lap damage from the back side of the wafer. The back side of the wafer may then be cleaned, etched, and polished, after which the front side of the wafer is polished. The back side grinding may be accomplished after the lapping without any other step of substantial removal of wafer material. The polishing of the back side of the wafer may be performed with a CMP machine and may produce a specular surface, visually free of damage under haze lamp inspection, with removal of about 0.5 microns of wafer material. After polishing the front side of the wafer, an epitaxial layer may be produced on the front side of the wafer.

Abstract: A timepiece having a decorative jewelry-like body defining a body cavity adapted to house a timekeeping portion and also provided a transparent cover in the form of gemstone, in one example. The timekeeping portion is hidden from plain view with the decorative jewelry-like body and time display is only visible when the time keeping portion is illuminated. In one example, the timekeeping portion is an LED watch works, which LED based digitals are normally off and thus invisible within the jewelry body and underneath the cover, and only visible when illuminated. In such an arrangement, the timepiece appears as jewelry to an observer as the time-keeping portion is hidden from view. Another embodiment of the timepiece is the ring that a button, located generally on or around the body of the ring, which may be accessed by a second finger on the same hand, preferably the thumb.

Abstract: A method is provided for processing the back side of a semiconductor wafer after the wafer has been lapped. The process includes grinding the back side of the wafer to remove wafer material, to substantially eliminate lap damage from the back side of the wafer. The back side of the wafer may then be cleaned, etched, and polished. after which the front side of the wafer is polished. The back side grinding may be accomplished after the lapping without any other step of substantial removal of wafer material. The polishing of the back side of the wafer may be performed with a CMP machine and may produce a specular surface, visually free of damage under haze lamp inspection, with removal of about 0.5 microns of wafer material. After polishing the front side of the wafer, an epitaxial layer may be produced on the front side of the wafer.