Abstract: A memory hub permits a graphics processor to access random access memories, such as dynamic random access memories (DRAMs). In one implementation, the memory hub permits an increase in effective memory bandwidth by aggregating the memory of two or more memories. In another implementation, the memory hub permits a graphics processor to offload memory access interfacing operations to the memory hub.

Abstract: An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer may define a frame with an outer periphery and an inner periphery.

Abstract: An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.

Abstract: An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer may define a frame with an outer periphery and an inner periphery.

Abstract: A memory hub permits a graphics processor to access random access memories, such as dynamic random access memories (DRAMs). In one implementation, the memory hub permits an increase in effective memory bandwidth by aggregating the memory of two or more memories. In another implementation, the memory hub permits a graphics processor to offload memory access interfacing operations to the memory hub.

Abstract: An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer may define a frame with an outer periphery and an inner periphery.

Abstract: A memory hub permits a graphics processor to access random access memories, such as dynamic random access memories (DRAMs). In one implementation, the memory hub permits an increase in effective memory bandwidth by aggregating the memory of two or more memories. In another implementation, the memory hub permits a graphics processor to offload memory access interfacing operations to the memory hub.

Abstract: An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.

Abstract: An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.

Abstract: The transmitter for projecting a beam of laser light includes a source of a beam of laser light, and a projection arrangement for directing the beam of laser light at a selected grade. The transmitter further includes a temperature sensor for detecting the temperature of said transmitter, and a temperature correction circuit, including a look-up table, responsive to said temperature sensor, for adjusting said projection arrangement in dependence upon offset grade values that are stored in said look-up table for a plurality of transmitter temperatures. These offset grade values are separately determined on an empirical basis for each transmitter, such that temperatures induced errors in the direction of the beam of laser light are compensated.

Abstract: The transmitter for projecting a beam of laser light includes a source of a beam of laser light, and a projection arrangement for directing the beam of laser light at a selected grade. The transmitter further includes a temperature sensor for detecting the temperature of said transmitter, and a temperature correction circuit, including a look-up table, responsive to said temperature sensor, for adjusting said projection arrangement in dependence upon offset grade values that are stored in said look-up table for a plurality of transmitter temperatures. These offset grade values are separately determined on an empirical basis for each transmitter, such that temperatures induced errors in the direction of the beam of laser light are compensated.

Abstract: A cooling system for an electronic device includes an air flow conduit for causing air outside a housing of the device to flow through a heat dissipation device. The conduit is configured to prevent substantial transfer of heat from air contained within the conduit and air in the remainder of the housing. The conduit walls include thermal and/or acoustic insulation. One or more fans in the conduit draw outside air into the conduit and expel air in the conduit to outside the housing.

Abstract: The present invention relates to computer systems. An embodiment provides an arrangement for a computer system; the arrangement comprising at least one terminal to provide dynamic information relating to an operating characteristic of the arrangement; and circuitry, using the at least one terminal, to produce an output signal bearing the dynamic information associated with the operating characteristic of the arrangement.

Abstract: A flip chip assembly machine (FCAM) (30) includes a main gantry (50) and a substrate camera gantry (40) that are configured to operate independently of each other and, respectively, support a die (12) and a substrate camera (38) for alignment purposes. The FCAM further includes a fluxer (130) for applying flux to the die. A flip-to-flux pick and place subassembly (116) picks up a die and places it in flux (46) independently of the operation of the main gantry, which may perform another task during the flux dwell time. A substrate carrier conveyor (154) includes a walking beam (260) to rapidly accelerate and decelerate substrate carrier movement into and out of the FCAM.

Abstract: A CPU heat sink and cooling fan combination is provided which automatically establishes an electrical connection for the cooling fan when the combination in inserted into a chip board.

Abstract: The present invention relates to a data processing system and method having a reduced power consumption. A power context is established for each application task, process or thread running within a computer system. The power context controls the operating conditions of the processor by, for example, reducing the frequency of the processor clock or the operating voltage of the processor. A scheduler is used to switch between threads a, in horn, between power contexts associated with the threads. The switching is performed according to the conventional priority switching of threads by an operating system. However, since each tread has an associated power context, the performance of the processor, and hence the power consumption is varied on a time slot-by-time slot basis.

Abstract: A cooling system for an electronic device includes an air flow conduit for causing air outside a housing of the device to flow through a heat dissipation device. The conduit is configured to prevent substantial transfer of heat from air contained within the conduit and air in the remainder of the housing. The conduit walls include thermal and/or acoustic insulation. One or more fans in the conduit draw outside air into the conduit and expel air in the conduit to outside the housing.

Abstract: The transmitter for projecting a beam of laser light includes a source of a beam of laser light, and a projection arrangement for directing the beam of laser light at a selected grade. The transmitter further includes a temperature sensor for detecting the temperature of said transmitter, and a temperature correction circuit, including a look-up table, responsive to said temperature sensor, for adjusting said projection arrangement in dependence upon offset grade values that are stored in said look-up table for a plurality of transmitter temperatures. These offset grade values are separately determined on an empirical basis for each transmitter, such that temperatures induced errors in the direction of the beam of laser light are compensated.

Abstract: The transmitter for projecting a beam of laser light includes a source of a beam of laser light, and a projection arrangement for directing the beam of laser light at a selected grade. The transmitter further includes a temperature sensor for detecting the temperature of said transmitter, and a temperature correction circuit, including a look-up table, responsive to said temperature sensor, for adjusting said projection arrangement in dependence upon offset grade values that are stored in said look-up table for a plurality of transmitter temperatures. These offset grade values are separately determined on an empirical basis for each transmitter, such that temperatures induced errors in the direction of the beam of laser light are compensated.