Abstract: A method of forming a layer from ink on a substrate, includes the steps of: depositing an ink volume with a slot-die coating device; first drying; and second drying.

Abstract: A method of manufacturing an optoelectronic device includes the successive steps of forming on a support first and second electrically-conductive pads; depositing an active organic layer covering the first and second electrically-conductive pads; depositing a first interface layer on the active organic layer in contact with the active organic layer; forming a first opening in the first interface layer and a second opening in the active organic layer in line with the first opening, to expose the second electrically-conductive pad; and forming a second interface layer at least partly extending in the first and second openings. The second interface layer is in contact with the first interface layer and with the second electrically-conductive pad.

Abstract: An optoelectronic device includes a substrate, an array of optoelectronic components covering the substrate, first conductive tracks coupled to the optoelectronic components, an adhesive layer covering a portion of the array, and a coating in contact with the adhesive layer, the coating including a periphery. The device further includes a second track reflecting a radiation at a wavelength in the range 335 nm to 10.6 ?m and extending aligned with the periphery along a given direction between the first conductive tracks and the coating.