Patents by Inventor David H. Altman

David H. Altman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190044340
    Abstract: An adaptive stability control system includes a direct current (DC) bus and one or more distributed controllers. The DC bus is configured to provide bidirectional pulsed power flow and energy storage. The distributed controller is configured to continuously measure an impedance of the DC bus and execute at least one adaptive control algorithm to regulate impedance of the DC bus to maintain stability of the bidirectional pulsed power flow and energy storage.
    Type: Application
    Filed: August 7, 2018
    Publication date: February 7, 2019
    Inventors: Boris S. Jacobson, David H. Altman, Charles P. Scheffler, Regan A. Zane
  • Publication number: 20180297144
    Abstract: A manifold structure has at least one flow passage and a center manifold section that has at least one machined cavity. The manifold structure includes a plurality of ultrasonically additively manufactured (UAM) finstock layers arranged in the flow passage. After the finstock is formed by UAM, the finstock is permanently joined to the center manifold section via a brazing or welding process. Using UAM and a permanent joining process enables joining of the UAM finstock having enhanced thermal features to a vacuum brazement structure. UAM enables the finstock to be formed of dissimilar metal materials or multi-material laminate materials. UAM also enables bond joints of the finstock to be arranged at angles greater than ten degrees relative to a horizontal axis by using the same aluminum material in the UAM process and in the vacuum brazing process.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 18, 2018
    Inventors: Travis L. Mayberry, James A. Pruett, Craig H. McCordic, David H. Altman
  • Patent number: 10018428
    Abstract: Methods and apparatus for a heat spreader including a vapor chamber, a fluid in the vapor chamber, a wick disposed in the vapor chamber, the wick comprising a metal wick structure, and a coating on wick comprising carbon nanotubes for promoting incipient boiling of the fluid.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: July 10, 2018
    Assignee: Raytheon Company
    Inventors: David H. Altman, Joseph R. Wasniewski, Anurag Gupta
  • Patent number: 9526192
    Abstract: A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: December 20, 2016
    Assignee: Raytheon Company
    Inventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
  • Publication number: 20160365300
    Abstract: A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the passthrough layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.
    Type: Application
    Filed: June 9, 2015
    Publication date: December 15, 2016
    Applicant: Raytheon Company
    Inventors: Anurag Gupta, David H. Altman, Jason G. Milne, Christopher R. Koontz
  • Patent number: 9502330
    Abstract: A coolant distribution structure for an MMIC having: an input/output layer with an input port for receiving a coolant for transmission to coolant channels in the MMIC and an output port for exiting the coolant after such coolant has cooled active devices in the MMIC, a coolant pass-through layer to receive the coolant from the input port and having structure to inhibit such received coolant from passing directly to the output port, a coolant distribution layer for receiving coolant passing from the coolant pass-through layer and distributing such received coolant to the cooling channels to absorb heat generated by the active devices and then directing heated coolant to the coolant distribution layer and out of the porting layer via the pass-through layer. The coolant pass-through layer has a structure configured to inhibit such heated coolant from passing directly to the input port prior to such heated absorbed coolant being transmitted to the output port.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: November 22, 2016
    Assignee: Raytheon Company
    Inventors: Anurag Gupta, David H. Altman, Jason G. Milne, Christopher R. Koontz
  • Patent number: 9318450
    Abstract: A monolithic microwave integrated circuit structure having: a semiconductor substrate structure having a plurality of active devices and a microwave transmission line having an input section, an output section and a interconnecting section electrically interconnecting the active devices on one surface of the substrate; a thermally conductive, electrically non-conductive heat sink; and a thermally conductive bonding layer for bonding the heat sink to the substrate, the thermally conductive bonding layer having an electrically conductive portion and an electrically non-conductive portion, the electrically conductive portion being disposed between the heat sink and an opposite surface of a portion of the substrate having the active devices and the electrically non-conductive portion being disposed on the opposite surface portion overlaying portion of the microwave transmission line section.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: April 19, 2016
    Assignee: RAYTHEON COMPANY
    Inventors: Shahed Reza, David H. Altman, Susan C. Trulli
  • Patent number: 8987892
    Abstract: A method for forming cooling channels in an interface for soldering to a semiconductor structure. The method includes: forming a metal seed layer on a surface of a substrate; patterning the metal seed layer into a patterned, plating seed layer covering portions of the substrate and exposing other portions of the substrate; using the patterned plating seed layer to form channels through the exposed portions of the substrate; and plating the patterned plating seed layer with solder. A heat exchanger having cooling channels therein is affixed to one surface of the interface and the semiconductor structure is soldered to an opposite surface of the interface. The cooling channels of the heat exchanger are aligned with the channels in the interface.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: March 24, 2015
    Assignee: Raytheon Company
    Inventors: William J. Davis, David H. Altman
  • Publication number: 20150013939
    Abstract: A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.
    Type: Application
    Filed: September 22, 2014
    Publication date: January 15, 2015
    Inventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
  • Patent number: 8839519
    Abstract: A scalable method of edge cooling and making a cold chassis for electronic modules. The steps include fabrication of modular cooling ribs, each including microchannels along the cooling edge and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a chassis frame member. The rib flanges are sealed (e.g. friction stir welded) with respect to the frame member. The Application includes new and retrofit environments with increased cooling needs and multi-scaled manufacturing.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: September 23, 2014
    Assignee: Raytheon Company
    Inventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
  • Patent number: 8809208
    Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: August 19, 2014
    Assignee: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield
  • Patent number: 8797741
    Abstract: A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: August 5, 2014
    Assignee: Raytheon Company
    Inventor: David H. Altman
  • Publication number: 20120325439
    Abstract: Methods and apparatus for a heat spreader including a vapor chamber, a fluid in the vapor chamber, a wick disposed in the vapor chamber, the wick comprising a metal wick structure, and a coating on wick comprising carbon nanotubes for promoting incipient boiling of the fluid.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Applicant: Raytheon Company
    Inventors: David H. Altman, Joseph R. Wasniewski, Anurag Gupta
  • Publication number: 20120097374
    Abstract: A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.
    Type: Application
    Filed: October 21, 2010
    Publication date: April 26, 2012
    Applicant: Raytheon Company
    Inventor: David H. Altman
  • Publication number: 20120094484
    Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Application
    Filed: December 28, 2011
    Publication date: April 19, 2012
    Applicant: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield
  • Patent number: 8106510
    Abstract: A semiconductor structure having: an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: January 31, 2012
    Assignee: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield
  • Publication number: 20110114289
    Abstract: A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.
    Type: Application
    Filed: November 16, 2009
    Publication date: May 19, 2011
    Inventors: David H. Altman, Scott R. Cheyne, Anurag Gupta
  • Publication number: 20110032678
    Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 10, 2011
    Applicant: Raytheon Company
    Inventors: David H. Altman, Erik F. Nordhausen, Steven D. Bernstein, Robert P. Molfino, Steven B. Wakefield
  • Publication number: 20100038056
    Abstract: A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of the base plate after passing through the fins of the condenser.
    Type: Application
    Filed: August 15, 2008
    Publication date: February 18, 2010
    Inventors: Joseph R. Ellsworth, Scott R. Cheyne, Michael E. Null, Michael P. Martinez, David H. Altman, Anthony J. Burdi
  • Patent number: 7548424
    Abstract: A radar transmit and receive integrated microwave module with conductively cooled condenser side rails and one or more vacuum brazed fluid distribution manifold cold plates in fluid communication with the side rails. There are one or more transmit and receive modules on a cold plate. Each module includes a coolant input and a coolant output. One or more gallium nitride monolithic microwave integrated circuits are within each transmit and receive module and each include a micro heat exchanger in fluid communication with the coolant input and the coolant output of the transmit and receive module to directly cool the gallium nitride monolithic microwave integrated circuit.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: June 16, 2009
    Assignee: Raytheon Company
    Inventors: David H. Altman, Joseph R. Ellsworth, Michael E. Null