Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.

Abstract: ? A thermal mechanical interface usable between a heatsink and a heat dissipating device is disclosed. In one embodiment, the thermal mechanical interface comprises a thermally conductive mechanically resilient member having a corrugated cross section and a first thermal conductance, disposed between the heat sink and the heat dissipating device and a thermal interface material having a second thermal conductance, disposed within the corrugated cross section.

Abstract: A modular circuit board assembly is disclosed. The modular circuit board assembly comprises a substrate, a circuit board, and a component, disposed between the circuit board and the substrate, the component physically and electrically coupled to the substrate. In one embodiment, the circuit board also comprises an aperture allowing for the transmission of thermal energy from the component to a heat sink. In still another embodiment of the invention, the heat sink includes a mesa having surface features cooperatively interacting with surface features on the component or members mounted on the component to provide for location and/or retention.

Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.

Abstract: A method, apparatus, and article of manufacture for transferring heat is disclosed. The apparatus comprises a first thermally conductive plate; a second thermally conductive plate; and an angularly corrugated member disposed between and in thermal communication first thermally conductive plate and the second thermally conductive plate. The angularly corrugated member has a contiguous periodically repeating cross section which includes a first cross section segment, disposable substantially parallel to and in thermal communication with the first thermally conductive plate, a second cross section segment, disposable substantially parallel to and in thermal communication with the second thermally conductive plate, and a third cross section segment, communicatively coupled to the first surface and the second surface, wherein the third cross section segment forming an angle with the first thermally conductive plate.

Abstract: An internal combustion engine comprising a crankcase adapted to rotatably support a crankshaft having an axis, the crankcase defining a plurality of crankcase chambers and including a generally flat manifold mounting surface including therein a first series of inlet openings aligned in the direction of the crankshaft axis, and a second series of inlet openings aligned in the direction of the crankshaft axis, the first and second series being laterally offset with respect to the direction of the crankshaft axis, and each of the inlet openings of the first and second series being respectively adapted to feed air to one of the crankcase chambers and having a minor dimension parallel to the crankshaft axis, a major dimension transverse to the crankshaft axis, and a portion overlapping the inlet openings of the other of the first and second series.

Abstract: A system for dynamically partitioning processors in a multiprocessor system intercoupled by a network utilizes, in association with each processor, a network accessible, locally changeable memory section. An available one of a number of common dynamic group addresses in each of the memories is reserved for a subgroup for the performance of subtasks within an overall task, and members of the group are designated as they receive messages to be processed. The members then locally update status words which establish membership, group validity and semaphore conditions, so that transactions may be initiated, coordinated and terminated with minimum involvement of processors that have no relevant subtasks. When the full task is completed the dynamic group is relinquished for use when a new task is to be undertaken. The system enables many tasks to be carried out concurrently with higher intercommunication efficiency.

Abstract: A system using a sorting network to intercouple multiple processors so as to distribute priority messages to all processors is characterized by semaphore means accessible to both the local processors and the global resource via the network. Transaction numbers identifying tasks are employed in the messages, and interfaces at each processor are locally controlled to establish transaction number related indications of the current status of each task being undertaken at the associated processor. A single query to all processors via the network elicits a prioritized response that denotes the global status as to that task. The transaction numbers also are used as global commands and local controls for the flow of messages. A destination selection system based on words in the messages is used as the basis for local acceptance or rejection of messages. This arrangement together with the transaction number system provides great flexibility as to intercommunication and control.

Abstract: A proximity coupled electro-optic device in which the electro-optic element has a pattern of conductors applied to the surface thereof abutting the individually addressable electrodes applying encoded data samples. The conductors are aligned in the same, or substantially the same, direction as the electrodes, and the period of the conductor pattern is equal to or less than the maximum width of the electrodes. Directional alignment tolerances between the conductors and electrodes are increased as the period of the conductor pattern is decreased, and when the conductors are segmented.

Abstract: The gap between the electrodes and the electro-optic element of a proximity coupled electro-optic device, such as a multi-gate light valve for an electro-optic line printer, is filled with a dielectric having a relative dielectric constant (i.e., the dielectric constant relative to that of air) which is substantially greater than 1, thereby reducing the effective electrical thickness of the gap which, in turn, enhances the proximity coupling.