Patents by Inventor David H. Hinzel

David H. Hinzel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of integrating MEMS device with low-resistivity silicon substrates
    Patent number: 6559530
    Abstract: A method of integrating MEMS devices with non-MEMS circuitry requires fabricating non-MEMS devices on a substrate in a conventional fashion. A thick dielectric layer is deposited on the completed devices, and the MEMS devices fabricated on the dielectric layer. Vias through the dielectric layer interconnect the MEMS devices to the non-MEMS electronics. The interposed dielectric layer allows the common substrate to have characteristics that best suit the non-MEMS components, without degrading the MEMS performance. Another approach involves bonding together two separate wafers—one for the MEMS devices and one for non-MEMS electronics. A package lid, having filled vias formed therethrough, is bonded to the MEMS wafer, sealing the MEMS devices within. The non-MEMS wafer is mounted to the lid, with the vias effecting the necessary interconnections between the two wafers.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: May 6, 2003
    Assignee: Raytheon Company
    Inventors: David H. Hinzel, Charles L. Goldsmith, Lloyd F. Linder
  • METHOD OF INTERGRATING MEMS DEVICE WITH LOW-RESISTIVITY SILICON SUBSTRATES
    Publication number: 20030054584
    Abstract: A method of integrating MEMS devices with non-MEMS circuitry requires fabricating non-MEMS devices on a substrate in a conventional fashion. A thick dielectric layer is deposited on the completed devices, and the MEMS devices fabricated on the dielectric layer. Vias through the dielectric layer interconnect the MEMS devices to the non-MEMS electronics. The interposed dielectric layer allows the common substrate to have characteristics that best suit the non-MEMS components, without degrading the MEMS performance. Another approach involves bonding together two separate wafers—one for the MEMS devices and one for non-MEMS electronics. A package lid, having filled vias formed therethrough, is bonded to the MEMS wafer, sealing the MEMS devices within. The non-MEMS wafer is mounted to the lid, with the vias effecting the necessary interconnections between the two wafers.
    Type: Application
    Filed: September 19, 2001
    Publication date: March 20, 2003
    Inventors: David H. Hinzel, Charles L. Goldsmith, Lloyd F. Linder