Abstract: A thick-film circuit module including a monolithic ceramic cross-over device, wherein the thick-film circuit includes a first conductive path and a second conductive path, transverse to the first conductive path and having spaced apart ends, and wherein the monolithic ceramic cross-over device is used in the second electrically conductive path as an electrically conductive device and for providing an insulative barrier between the first and second electrically conductive paths. The monolithic cross-over device comprises a ceramic chip including a plurality of stacked generally planar layers of ceramic material and electrically conductive metalized paths sandwiched between the respective layers of ceramic material, the ceramic chip having each of its opposite ends supporting an electrically conductive termination end cap, and the opposite ends of each of the electrically conductive metalized paths being connected to the respective termination end caps.