Patents by Inventor David H. Menche

David H. Menche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planar lightwave circuit active device metallization process
    Patent number: 6709882
    Abstract: A method for making a resistive heater for a planar lightwave circuit. The method includes the step of depositing a resistive layer on a top clad of a planar lightwave circuit. An interconnect layer is subsequently deposited over the resistive layer. The resistive layer can be tungsten and the interconnect layer can be aluminum. The interconnect layer is then etched to define a heater interconnect, wherein the heater interconnect is disposed over the resistive layer and has a first width. The heater interconnect is then masked, and the resistive layer is etched to define a resistive heater. The resistive heater is disposed beneath the heater interconnect and has a second width larger than the first width.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: March 23, 2004
    Assignee: Lightwave Microsystems Corporation
    Inventors: Pamela S. Trammel, Jonathan G. Bornstein, David H. Menche
  • Planar lightwave circuit active device metallization process
    Publication number: 20030040135
    Abstract: A method for making a resistive heater for a planar lightwave circuit. The method includes the step of depositing a resistive layer on a top clad of a planar lightwave circuit. An interconnect layer is subsequently deposited over the resistive layer. The resistive layer can be tungsten and the interconnect layer can be aluminum. The interconnect layer is then etched to define a heater interconnect, wherein the heater interconnect is disposed over the resistive layer and has a first width. The heater interconnect is then masked, and the resistive layer is etched to define a resistive heater. The resistive heater is disposed beneath the heater interconnect and has a second width larger than the first width.
    Type: Application
    Filed: August 27, 2001
    Publication date: February 27, 2003
    Inventors: Pamela S. Trammel, Jonathan G. Bornstein, David H. Menche