Patents by Inventor David H. Nicol
David H. Nicol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10108232Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.Type: GrantFiled: December 5, 2016Date of Patent: October 23, 2018Assignee: CAREFUSION 303, INC.Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
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Publication number: 20170083060Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.Type: ApplicationFiled: December 5, 2016Publication date: March 23, 2017Inventors: David H. NICOL, Michael Dugan JOYCE, Brendan BURGESS
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Patent number: 9513675Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.Type: GrantFiled: August 19, 2014Date of Patent: December 6, 2016Assignee: CareFusion 303, Inc.Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
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Publication number: 20150035420Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.Type: ApplicationFiled: August 19, 2014Publication date: February 5, 2015Inventors: David H. NICOL, Michael Dugan JOYCE, Brendan BURGESS
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Patent number: 8809697Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.Type: GrantFiled: May 5, 2011Date of Patent: August 19, 2014Assignee: CareFusion 303, Inc.Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
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Patent number: 8508956Abstract: A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element is configured to provide an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.Type: GrantFiled: May 5, 2011Date of Patent: August 13, 2013Assignee: CareFusion 303, Inc.Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
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Publication number: 20120281360Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.Type: ApplicationFiled: May 5, 2011Publication date: November 8, 2012Applicant: CareFusion 303, Inc.Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
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Publication number: 20120281368Abstract: A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element is configured to provide an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.Type: ApplicationFiled: May 5, 2011Publication date: November 8, 2012Applicant: CareFusion 303, Inc.Inventors: David H. Nicol, Michael Dugan Joyce, Brendan Burgess
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Patent number: 5429470Abstract: An inter-system transport mechanism for moving data cartridges between robotic data cartridge handling systems in an automated fashion is disclosed. Each data cartridge handling system includes a carousel-type storage mechanism for storing a plurality of data cartridges. A gripper mechanism comprising a gripper assembly, an extension axis assembly, and a vertical rail assembly is provided to transport the data cartridges to the storage mechanism and the inter-system transport mechanism.Type: GrantFiled: October 20, 1992Date of Patent: July 4, 1995Assignee: Odetics, Inc.Inventors: David H. Nicol, Mark J. Rouillard
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Patent number: D713798Type: GrantFiled: June 28, 2012Date of Patent: September 23, 2014Assignee: Carefusion 303, Inc.Inventor: David H. Nicol