Abstract: Improved methods for performing burn-in of electronic components, such as integrated circuits (ICs) with on-board thermal sense circuits, are used to obtain a higher bin split. According to an embodiment, a thermal set-point is loaded into each IC. While the ICs are maintained at a constant elevated temperature, the burn-in system checks each IC to determine whether the set-point has been exceeded. If so, it characterizes the IC by that set-point; if not, it decrements the set-point and checks again. The method continues until all ICs have been characterized to a specific set-point. As a result of the method, a junction temperature is obtained for each IC. In addition, a real-time estimate of the burn-in time for each IC is obtained, so that burn-in time can be adjusted to maximize burn-in throughput. Apparatus for implementing improved IC burn-in is also described.

Abstract: Improved methods for performing burn-in of electronic components, such as integrated circuits (ICs) with on-board thermal sense circuits, are used to obtain a higher bin split. According to one embodiment, a thermal set-point is loaded into each IC. While the ICs are maintained at a constant elevated temperature, the burn-in system checks each IC to determine whether the set-point has been exceeded. If so, it characterizes the IC by that set-point; if not, it decrements the set-point and checks again. The method continues until all ICs have been characterized to a specific set-point. As a result of the method, a junction temperature is obtained for each IC. In addition, a real-time estimate of the burn-in time for each IC is obtained, so that burn-in time can be adjusted to maximize burn-in throughput. Apparatus for implementing improved IC burn-in is also described.

Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.

Abstract: Improved methods for performing burn-in of electronic components, such as integrated circuits (ICs) with on-board thermal sense circuits, are used to obtain a higher bin split. According to one embodiment, a thermal set-point is loaded into each IC. While the ICs are maintained at a constant elevated temperature, the burn-in system checks each IC to determine whether the set-point has been exceeded. If so, it characterizes the IC by that set-point; if not, it decrements the set-point and checks again. The method continues until all ICs have been characterized to a specific set-point. As a result of the method, a junction temperature is obtained for each IC. In addition, a real-time estimate of the burn-in time for each IC is obtained, so that burn-in time can be adjusted to maximize burn-in throughput. Apparatus for implementing improved IC burn-in is also described.

Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.

Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.

Abstract: A circuit that senses changes in the electrical characteristics of one or more solder joints, and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. In a further aspect of the present invention, the one or more signals generated by the circuit are indicative of the reliability of the solder joints. Embodiments of the present invention provide a warning in advance of system failure, permitting repair or replacement of a failing unit/joint before a failure becomes catastrophic. Embodiments of the present invention include structures and circuitry that can determine whether solder joint failure has occurred, and that can communicate the occurrence of solder joint failure to other components or systems.

Abstract: A circuit that senses changes in the electrical characteristics of one or more circuit elements and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. In a further aspect of the present invention, the one or more signals generated by the circuit are indicative of the reliability of an electronic device into which an embodiment of the present invention is incorporated.

Abstract: A circuit that senses changes in the electrical characteristics of one or more circuit elements and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. In a further aspect of the present invention, the one or more signals generated by the circuit are indicative of the reliability of an electronic device into which an embodiment of the present invention is incorporated.

Abstract: A circuit that senses changes in the electrical characteristics of a guard ring, and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit The one or more signals generated by the circuit are indicative of the reliability of the integrated circuit. In one embodiment of the present invention, a first point of the guard ring is electrically coupled to a voltage supply node by a switchable element such as a MOSFET, and at least two points of the guard ring are electrically coupled respectively to two input terminals of a differential amplifier circuit in such a way that voltage changes across the guard ring can be sensed.

Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.

Abstract: A circuit that senses changes in the electrical characteristics of a guard ring, and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. The one or more signals generated by the circuit are indicative of the reliability of the integrated circuit.

Abstract: A circuit that senses changes in the electrical characteristics of one or more circuit elements and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. In a further aspect of the present invention, the one or more signals generated by the circuit are indicative of the reliability of an electronic device into which an embodiment of the present invention is incorporated.

Abstract: A circuit that senses changes in the electrical characteristics of a guard ring, and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. The one or more signals generated by the circuit are indicative of the reliability of the integrated circuit.In one embodiment of the present invention, a first point of the guard ring is electrically coupled to a voltage supply node by a switchable element such as a MOSFET, and at least two points of the guard ring are electrically coupled respectively to two input terminals of a differential amplifier circuit in such a way that voltage changes across the guard ring can be sensed.