Abstract: A method for determining a wire connection plan includes receiving a wiring specification including a set of links and a first set of connection points. Each link specifies a connection between two connection points of the first set of connection points. The method includes determining the wire connection plan including an ordered sequence of wire segments linking points of a second set of connection points, the second set of connection points including the first set of connection points and a set of additional connection points.

Abstract: A two-sided substrateless multichip module including at least one die layer having at least one die. At least one bottomside interconnect layer is coupled to a bottom surface of the at least one die. At least one topside interconnect layer is coupled to a top surface of the at least one die. One or more embedded electrical connections is configured to provide an electrical interconnection between the at least one bottomside interconnect layer and the at least one die and/or the at least bottomside interconnect layer and the at least one topside interconnect layer and/or the at least one topside interconnect layer and the at least one die, wherein the at least one bottomside interconnect layer includes one or more electrical contacts on a bottom surface of the multichip module and the at least topside interconnect layer includes one or more electrical contacts on a top surface of the multichip module.