Abstract: A system for administering an activity to a participant, having at least one camera module configured to capture image data of at least one participant's eye, and at least one processor configured to receive a first plurality of images of the at least one eye, generate a first set of data of movements of the at least one eye, receive a second plurality of images of the at least one eye during a second time period, generate a second set of data of movements of the at least one eye based on the second plurality of images, and determine if at least one undesired event occurred based on the analysis of the activity data and the reference data for the participant.

Abstract: A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.

Abstract: A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.

Abstract: A system and method for assembly of semiconductor dies to flexible circuits, wherein the present invention utilizes UV release tape as a temporary, removable carrier for precisely aligning, and maintaining the alignment of, a semiconductor die, and more specifically, the interconnecting pads thereof, with the conducting leads of a flexible circuit; thereby, expediting subsequent permanent affixation of same via thermo-sonic TAB bonding processes, or the like.