Patents by Inventor David Hardell

David Hardell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7714423
    Abstract: A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: May 11, 2010
    Assignee: Apple Inc.
    Inventors: Gavin Reid, Ihab Ali, Chris Ligtenberg, Ron Hopkinson, David Hardell
  • Publication number: 20070075412
    Abstract: A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.
    Type: Application
    Filed: September 30, 2005
    Publication date: April 5, 2007
    Inventors: Gavin Reid, Ihab Ali, Chris Ligtenberg, Ron Hopkinson, David Hardell
  • Publication number: 20060046573
    Abstract: A card connector that allows a card to be at least partially coplanar with a logic board is described herein. A system having a card at least partially coplanar with a logic board is also disclosed. A card connector that allows at least one longitudinal plane through the logic board to intersect at least a point of the card is also disclosed. The card may be a memory module.
    Type: Application
    Filed: August 30, 2004
    Publication date: March 2, 2006
    Inventor: David Hardell