Abstract: A liquid to refrigerant heat exchanger includes an enclosed coolant volume that is at least partially defined by a plastic housing and by a metal closure plate. The metal closure plate can be part of a brazed assembly containing a continuous refrigerant flow path. The refrigerant flow path is disposed within the coolant volume, where heat can be transferred between the refrigerant within the refrigerant flow path and the liquid within the coolant volume. The plastic housing can at least partially surround the refrigerant flow path to at least partially bound a liquid flow path along a portion of the coolant volume. An inlet diffuser and an outlet diffuser can be mounted to the housing to direct the liquid through the housing. The plastic housing is sealingly joined to the closure plate along an outer periphery of the closure plate.

Abstract: A liquid to refrigerant heat exchanger includes a coolant volume that is at least partially defined by a plastic housing and by a metal closure plate. The plastic housing is sealingly joined to the closure plate along an outer periphery of the closure plate. The metal closure plate can be part of a brazed assembly that defines a continuous refrigerant flow path through the heat exchanger between a refrigerant inlet port and a refrigerant outlet port.

Abstract: A liquid to refrigerant heat exchanger includes a coolant volume that is at least partially defined by a plastic housing and by a metal closure plate. The plastic housing is sealingly joined to the closure plate along an outer periphery of the closure plate. The metal closure plate can be part of a brazed assembly that defines a continuous refrigerant flow path through the heat exchanger between a refrigerant inlet port and a refrigerant outlet port.

Abstract: A liquid to refrigerant heat exchanger includes an enclosed coolant volume that is at least partially defined by a plastic housing and by a metal closure plate. The metal closure plate can be part of a brazed assembly containing a continuous refrigerant flow path. The refrigerant flow path is disposed within the coolant volume, where heat can be transferred between the refrigerant within the refrigerant flow path and the liquid within the coolant volume. The plastic housing can at least partially surround the refrigerant flow path to at least partially bound a liquid flow path along a portion of the coolant volume. An inlet diffuser and an outlet diffuser can be mounted to the housing to direct the liquid through the housing. The plastic housing is sealingly joined to the closure plate along an outer periphery of the closure plate.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

Abstract: A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance. interconnect.

Abstract: The present invention, in one form, is a fuel pump having increased pump inlet suction and outlet pressures as compared to known fuel pumps. Such pressure increases enable use of one fuel pump even with an engine including multiple cylinder banks, and facilitates elimination of vapor and air bubbles in the fuel. The fuel pump also does not include small, or narrow passages that are prone to be clogged by dirt or the like. More specifically, and in one embodiment, the fuel pump includes a pump housing including an inlet and an outlet. An inlet nozzle extends from the inlet, and -an outlet nozzle extends from the outlet. The inlet nozzle is configured to be coupled to a fuel line extending from a fuel tank, and the outlet nozzle is configured to be coupled to a fuel line extending to the engine block. The pump further includes first and second pump inlet covers. Each cover includes an air nozzle.

Abstract: The present invention, in one form, is a fuel pump having increased pump inlet suction and outlet pressures as compared to known fuel pumps. Such pressure increases enable use of one fuel pump even with an engine including multiple cylinder banks, and facilitates elimination of vapor and air bubbles in the fuel. The fuel pump also does not include small, or narrow passages that are prone to be clogged by dirt or the like. More specifically, and in one embodiment, the fuel pump includes a pump housing including an inlet and an outlet. An inlet nozzle extends from the inlet, and an outlet nozzle extends from the outlet. The inlet nozzle is configured to be coupled to a fuel line extending from a fuel tank, and the outlet nozzle is configured to be coupled to a fuel line extending to the engine block. The pump further includes first and second pump inlet covers. Each cover includes an air nozzle.

Abstract: An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.

Abstract: A fuel system vapor separator has an outer housing member with a generally cylindrical internal wall and has two open opposed ends. A generally cylindrical inner housing member is fitted within the outer housing member and defines a sealed space between the two housing members. The housing members are sealingly closed at both ends. An inlet introduces fuel into the central region of the inner housing member while another inlet introduces a coolant fluid into the space defined between the outer and inner housing members for cooling the fuel. A float operated valve vents out fuel vapor accumulating within the inner housing member. The housing members are formed by an extrusion process such that they can be cut to various lengths depending upon the desired size of the assembled vapor separator.

Abstract: A Pulse Amplitude Modulation (PAM) generator that generates multilevel PAM signals at frequencies over 1 GHz is disclosed. The PAM generator uses Emitter Coupled Logic (ECL) technology that implements differential pair current switches such that the outputs are summed to produce precisely balanced PAM signals.

Abstract: An autonomous processor for displaying on a video tube both text characters and facsimile data. To conserve memory space the facsimile data is stored in compressed form and is decompressed or unfolded in synchronism with the vertical and horizontal deflections in the video tube. Similarly the text characters are stored in coded form, together with interspaced commands, both inscribed in a list memory. Each character code in the list then selects an appropriate dot matrix from a font memory which also contains displacement data. Selected lines of the font dot matrices are then addressed by row coordinates to form a horizontal video signal, which is accumulated in a ping pong buffer concurrently unloading into a video register. This same video register merges the facsimile data which is concurrently unfolded.

Abstract: An autonomous processor for displaying on a video tube both text characters and facsimile data. To conserve memory space the facsimile data is stored in compressed form and is decompressed or unfolded in synchronism with the vertical and horizontal deflections in the video tube. Similarly the text characters are stored in coded form, together with interspaced commands, both inscribed in a list memory. Each character code in the list then selects an appropriate dot matrix from a font memory which also contains displacement data. Selected lines of the font dot matrices are then addressed by row coordinates to form a horizontal video signal, which is accumulated in a ping pong buffer concurrently unloading into a video register. This same video register merges the facsimile data which is concurrently unfolded.

Abstract: A distributed function processing system utilizing a conventional microprocessor operated as a text processor in combination with a plurality of other autonomous processing devices arranged to operate in a coherent processing system. One of the autonomous processors which is a memory control processor serves to periodically overlay a random access accelerator memory with the contents of a main memory system and concurrently resolves conflicts among various other autonomous memory service requests. This processor, therefore, accommodates the data rates of the main memory. The other processor is a display processor which generates signals to a video display system to provide a visual interface to the user and is therefore tied to the video rate. Accordingly, the processing burden is distributed within processors entailing differing rates operating autonomously.