Abstract: Aspects herein are directed to an apparel item that promotes thermo-regulation through the use of engineered openings, venting, and/or stand-off structures. In exemplary aspects, 20-45% of the apparel item may comprise the engineered openings. Vents may be positioned on the apparel item in areas that experience high amounts of air flow to help channel air into the apparel item. The stand-off structures may be positioned on an inner-facing surface of the apparel item where they help to create a space between the apparel item and the wearer's body surface in which air can flow and help cool the wearer by promoting evaporative cooling.

Abstract: A method of forming a multi-chip system is disclosed. The method includes forming one or more bumps on respective conductive contact pads of a first electronic device, forming one or more mini-bumps on respective conductive contact pads of a second electronic device, and aligning respective one or more mini-bumps with respective one or more bumps. The method further includes performing a bump bonding process that exerts compression force on one or both the first electronic device and the second electronic device to compress the one or more mini-bumps into the one or more bumps to form one or more bump bond structures that bond the second electronic device to the first electronic device.

Abstract: A transaction is detected on a transaction terminal. A first code is presented on a display of the transaction terminal that is encoded with an identifier and a passcode for a wireless connection between the transaction terminal and a mobile device operated by a customer. The mobile device processes the code to wirelessly connect to the transaction terminal using the identifier and the passcode. A second code is presented on a display of the transaction terminal. The second code when captured by the mobile device causes a transaction interface to be remoted from the transaction terminal to the mobile device over the wireless connection. The transaction continues with interactions provided on the mobile device and processed on the transaction terminal without any customer touching of the display of the transaction terminal and without any customer touching of any keys or keypad of the transaction terminal.

Abstract: A cable reel for retaining a continuous length of cable is preferably constructed using an inexpensive plastic material, such as corrugated plastic. In one embodiment, the cable reel includes a hollow tubular core with a set of outward radial tabs integrally formed at each of its ends. A single, disc-shaped, interior support flange is mounted within the interior of the core in circumferential contact therewith to provide structural rigidity. Additionally, on each end of the core, an annular inner flange and a disc-shaped outer flange are disposed in coaxial alignment with one another against opposing surfaces of its corresponding set of radial tabs and are fixedly secured together as part of the assembly process. The multi-flange construction enables the thickness, diameter and/or material properties of the ends of the cable reel to be adjusted, as needed, to accommodate the strength and dimensional requirements of the intended application.

Abstract: A composite rebar having ridges formed therein by grinding is buffed and/or coated to reduce the surface roughness caused by fibers extending from the rebar.

Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: A binder composition for use in the manufacture of a nonwoven mat including a low-density fiber, and nonwoven mats made with the binder, are disclosed. The low-density fiber is able to reduce the acoustic openness of the nonwoven mats made therefrom while also capable of being delivered with existing binder technology and equipment.

Abstract: A high modulus composite part is disclosed comprising a polymer resin; and a plurality of high-performance unidirectional glass fibers. The high-performance unidirectional glass fibers have an elastic modulus of at least 89 GPa and a tensile strength of at least 4,000 MPa, according to ASTM D2343-09. The composite part comprises a fiber weight fraction (FWF) of no more than 88% and an elastic modulus of at least 60 GPa, according to ASTM D7205.

Abstract: A transaction is detected on a transaction terminal. A first code is presented on a display of the transaction terminal that is encoded with an identifier and a passcode for a wireless connection between the transaction terminal and a mobile device operated by a customer. The mobile device processes the code to wirelessly connect to the transaction terminal using the identifier and the passcode. A second code is presented on a display of the transaction terminal. The second code when captured by the mobile device causes a transaction interface to be remoted from the transaction terminal to the mobile device over the wireless connection. The transaction continues with interactions provided on the mobile device and processed on the transaction terminal without any customer touching of the display of the transaction terminal and without any customer touching of any keys or keypad of the transaction terminal.

Abstract: A transaction is detected on a transaction terminal. A first code is presented on a display of the transaction terminal that is encoded with an identifier and a passcode for a wireless connection between the transaction terminal and a mobile device operated by a customer. The mobile device processes the code to wirelessly connect to the transaction terminal using the identifier and the passcode. A second code is presented on a display of the transaction terminal. The second code when captured by the mobile device causes a transaction interface to be remoted from the transaction terminal to the mobile device over the wireless connection. The transaction continues with interactions provided on the mobile device and processed on the transaction terminal without any customer touching of the display of the transaction terminal and without any customer touching of any keys or keypad of the transaction terminal.

Abstract: A binder composition for use in the manufacture of a nonwoven mat including a low-density fiber, and nonwoven mats made with the binder, are disclosed. The low-density fiber is able to reduce the acoustic openness of the nonwoven mats made therefrom while also capable of being delivered with existing binder technology and equipment.

Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

Abstract: A flexible connector includes a unitary connector block having first and second board-facing areas. The first and second board-facing areas are longitudinally spaced from each other on a chosen surface of the connector block. The connector block includes a block body transversely separating the chosen surface from an opposing surface oppositely facing from the chosen surface. The connector block includes a flexible connector bridge longitudinally interposed between the first and second board-facing areas. A first connector port is located within the first board-facing area. A second connector port is located within the second board-facing area. A connector trace extends through at least a portion of the block body between the first and second board-facing areas. The connector trace electrically connects the first and second connector ports. Methods of making and using the flexible connector are also included.

Abstract: A superconducting structure includes a first superconducting device having a plurality of first superconducting contact pads disposed on a top side of a first superconducting device, a second superconducting device having a plurality of second superconducting contact pads disposed on a bottom side of a second superconducting device, and a plurality of superconducting bump structures with a given bump structure coupling respective superconducting contact pads of the plurality of first superconducting contact pads and the second plurality of superconducting pads to one another to bond the first superconducting device to the second superconducting device. Each superconducting bump structure includes a first under bump metallization (UBM) layer disposed on the top surface of a given superconducting contact pad, a second UBM layer disposed on the top surface of a given superconducting contact pads, and a superconducting metal layer coupling the first UBM layer to the second UBM layer.

Abstract: A superconducting structure includes a first superconducting device having a plurality of first superconducting contact pads disposed on a top side of a first superconducting device, a second superconducting device having a plurality of second superconducting contact pads disposed on a bottom side of a second superconducting device, and a plurality of superconducting bump structures with a given bump structure coupling respective superconducting contact pads of the plurality of first superconducting contact pads and the second plurality of superconducting pads to one another to bond the first superconducting device to the second superconducting device. Each superconducting bump structure includes a first under bump metallization (UBM) layer disposed on the top surface of a given superconducting contact pad, a second UBM layer disposed on the top surface of a given superconducting contact pads, and a superconducting metal layer coupling the first UBM layer to the second UBM layer.

Abstract: A flexible connector includes a unitary connector block having first and second board-facing areas. The first and second board-facing areas are longitudinally spaced from each other on a chosen surface of the connector block. The connector block includes a block body transversely separating the chosen surface from an opposing surface oppositely facing from the chosen surface. The connector block includes a flexible connector bridge longitudinally interposed between the first and second board-facing areas. A first connector port is located within the first board-facing area. A second connector port is located within the second board-facing area. A connector trace extends through at least a portion of the block body between the first and second board-facing areas. The connector trace electrically connects the first and second connector ports. Methods of making and using the flexible connector are also included.

Abstract: An apparatus includes a top conductive layer of on an integrated circuit waveguide filter and a bottom conductive layer. The top and bottom conductive layers are coupled via a plurality of couplers that form an outline of the waveguide filter. A dielectric substrate layer is disposed between the top conductive layer and the bottom conductive layer of the integrated circuit waveguide filter. The dielectric substrate layer has a relative permittivity, ?r that affects the tuning of the integrated circuit waveguide filter. At least one tunable via includes a tunable material disposed within the dielectric substrate layer and is coupled to a set of electrodes. The set of electrodes enable a voltage to be applied to the tunable material within the tunable via to change the relative permittivity of the dielectric substrate layer and to enable tuning the frequency characteristics of the integrated circuit waveguide filter.

Abstract: A multi-platform television comprises at least one television signal interface to receive premium television services from at least two different television service providers. The television further comprises a programmable conditional access system to enable conditional access to the premium television services received by the at least one television signal interface from the at least two different service providers.