Patents by Inventor David Heason

David Heason has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor etching process control
    Publication number: 20050117165
    Abstract: The thickness of a silicon wafer (3) within a processing vacuum enclosure (1) is measured or monitored by an optical apparatus (50) via a window (4). The optical apparatus (5) comprises a laser which is tuneable across a range of wavelengths while maintaining a narrow bandwidth. The optical apparatus (5) also includes a detector receiving reflected light. The wavelength variation produces interference effects which are used, by examination of the detector output, to give a measure of thickness or other parameters.
    Type: Application
    Filed: March 18, 2003
    Publication date: June 2, 2005
    Applicant: The BOC Group, Inc.
    Inventors: Mark Holbrook, David Heason, David Reeve, Michael Boger, Florian L'Hostis
  • Control of etch and deposition processes
    Publication number: 20050042777
    Abstract: This invention relates to the control of etch and deposition processes in the manufacture of semiconductor devices, microelectronic machines (MEMs), and waveguides.
    Type: Application
    Filed: August 20, 2003
    Publication date: February 24, 2005
    Applicant: The BOC Group Inc.
    Inventors: Michael Boger, Mark Holbrook, David Heason, Florian L'Hostis, David Reeve