Patents by Inventor David Heemstra

David Heemstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7759600
    Abstract: A system for producing plasma tubes that can withstand a wide variety of physical and environmental stressors within a plasma processing system is disclosed. Within such a plasma processing system, a plasma tube structure has a central body portion—having a fixed outer diameter. At a first end of the plasma tube structure, an outwardly extending flange may be provided. At a second end of the plasma tube, an edge portion is provided—having an outer diameter that is less than the fixed outer diameter of the central body portion. The edge portion is formed to facilitate easy and secure engagement of the plasma tube structure with a compression mechanism. The plasma tube structure is formed of material that provides sufficient structural integrity and degradation resistance.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: July 20, 2010
    Assignees: Samsung Austin Semiconductor, L.P., Samsung Electronics Co., Ltd.
    Inventors: David Heemstra, Kevin White
  • Publication number: 20080289766
    Abstract: An apparatus with an edge ring configured to surround a perimeter of a semiconductor wafer in a semiconductor process, the edge ring having a plurality of protrusions located on an upper surface of the edge ring, the protrusions capable of preventing the semiconductor wafer from moving outside the bounds of a process plane. There is also an apparatus having a semiconductor process chamber and an electrostatic chuck, a semiconductor wafer, and an edge ring. There is also a method including providing a semiconductor process chamber, semiconductor wafer disposed within the semiconductor process chamber, and an edge ring, the edge ring having a plurality of protrusions located on an upper surface of the edge ring, the protrusions capable of preventing the semiconductor wafer from moving outside the bounds of a process plane. The method also includes performing an etch process on the semiconductor wafer.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 27, 2008
    Applicants: Samsung Austin Semiconductor LP, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: David Heemstra, Rex Silva, Michael Leone, Jim Gernert
  • Publication number: 20070215281
    Abstract: A system for producing plasma tubes that can withstand a wide variety of physical and environmental stressors within a plasma processing system is disclosed. Within such a plasma processing system, a plasma tube structure has a central body portion—having a fixed outer diameter. At a first end of the plasma tube structure, an outwardly extending flange may be provided. At a second end of the plasma tube, an edge portion is provided—having an outer diameter that is less than the fixed outer diameter of the central body portion. The edge portion is formed to facilitate easy and secure engagement of the plasma tube structure with a compression mechanism. The plasma tube structure is formed of material that provides sufficient structural integrity and degradation resistance.
    Type: Application
    Filed: March 15, 2006
    Publication date: September 20, 2007
    Applicants: SAMSUNG AUSTIN SEMICONDUCTOR, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: David Heemstra, Kevin White