Patents by Inventor David Hees

David Hees has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11965851
    Abstract: Methods of using grids in connection with suitable microscopy techniques, such as for determining the structure of target compounds including proteins, are disclosed. Said grid comprising a coating modified with one or more capture agents and a deactivating agent.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: April 23, 2024
    Assignee: Purdue Research Foundation
    Inventors: David H. Thompson, Christopher Benjamin, Kyle Wright, Scott C. Bolton, Seok-Hee Hyun
  • Patent number: 9991209
    Abstract: A method of fabricating an electrical guard structure for providing signal isolation is provided. The method includes providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component. The method further comprises synthesizing a plurality of thread-like structures over the substrate to collectively form one or more electrically conductive projections extending transverse to the mounting surface. The one or more electrically conductive projections include one or more wall-like structures which are elongate parallel to the mounting surface. The electrically conductive projections can be transferred to another surface such as a major surface of a second substrate. There are further provided a support structure and a guard structure having the wall-like electrically conductive projections which are electrically grounded when in use to provide signal isolation.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: June 5, 2018
    Inventors: Dunlin Tan, Jong Jen Yu, David Hee, Beng Kang Tay, Dominique Baillargeat
  • Publication number: 20160293554
    Abstract: A method of fabricating an electrical guard structure for providing signal isolation is provided. The method includes providing a substrate having a mounting surface comprising a first area for hosting at least one electronic component. The method further comprises synthesizing a plurality of thread-like structures over the substrate to collectively form one or more electrically conductive projections extending transverse to the mounting surface. The one or more electrically conductive projections include one or more wall-like structures which are elongate parallel to the mounting surface. The electrically conductive projections can be transferred to another surface such as a major surface of a second substrate. There are further provided a support structure and a guard structure having the wall-like electrically conductive projections which are electrically grounded when in use to provide signal isolation.
    Type: Application
    Filed: October 7, 2014
    Publication date: October 6, 2016
    Applicant: Thales Solution Asia Pte Ltd.
    Inventors: Dunlin TAN, Jong Jen YU, David Hee, Beng Kang Tay, Dominique Baillargeat
  • Publication number: 20050210797
    Abstract: A door assembly of the present invention is assembled from a pair of hollow core stiles and a pair of rails. A panel is inserted between and extended into the rails and the stiles. The stiles and the rails and the panel are then interconnected to form a stile and rail style door assembly.
    Type: Application
    Filed: March 15, 2004
    Publication date: September 29, 2005
    Inventor: David Hees