Abstract: An apparatus for dispensing a liquid comprising: a supply flow path; a pressurised liquid source arranged to supply pressurised liquid to the supply flow path; a junction downstream of the pressurised liquid source, wherein at the junction the supply flow path is branched into a dispense flow path and a return or drain flow path; and a valve or pump in the return or drain flow path downstream of the junction.

Abstract: An apparatus and method for processing wafer-shaped articles utilizes at least first and second liquid-dispensing nozzles, wherein a first liquid-dispensing nozzle is positioned closer to an axis of rotation than the second liquid-dispensing nozzle. A liquid supply system supplies heated process liquid to the nozzles such that process liquid dispensed from the first nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from the second liquid-dispensing nozzle.

Abstract: In an apparatus for treating a wafer-shaped article, a spin chuck is provided for holding and rotating a wafer-shaped article. A liquid dispenser comprises a supply conduit that divides to form a first branch extending toward a dispensing outlet of the liquid dispenser and a second branch communicating with a vent opening of the liquid dispenser. The second branch extends upwardly relative to the first branch over at least a portion of its length.

Abstract: An apparatus and method for processing wafer-shaped articles utilizes at least first and second liquid-dispensing nozzles, wherein a first liquid-dispensing nozzle is positioned closer to an axis of rotation than the second liquid-dispensing nozzle. A liquid supply system supplies heated process liquid to the nozzles such that process liquid dispensed from the first nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from the second liquid-dispensing nozzle.

Abstract: A power supply circuit detects ground fault paths, and miswiring of the load, using a test mode in which electrical power is applied to only one power output terminal of the power supply relative to the ground terminal, while substantially no electrical power is applied to the second power output terminal relative to the ground terminal. If application of power during the test mode causes substantial current flow through ground, then there is a ground fault path, or an incorrect connection between the midpoint of the load and ground. The power supply further includes unique features for signaling the presence and kind of fault it has detected; the power supply is capable of distinguishing between ground faults in at least two different locations, and when a fault is detected, the power supply signals the presence of the fault and its location, e.g., by timed blinking of the connected discharge light. These features are enhanced by a diagnostic analyzer for connection to the power supply.

Abstract: A power supply circuit detects ground fault paths, and miswiring of the load, using a test mode in which electrical power is applied to only one power output terminal of the power supply relative to the ground terminal, while substantially no electrical power is applied to the second power output terminal relative to the ground terminal. If application of power during the test mode causes substantial current flow through ground, then there is a ground fault path, or an incorrect connection between the midpoint of the load and ground. The power supply further includes unique features for signaling the presence and kind of fault it has detected; the power supply is capable of distinguishing between ground faults in at least two different locations, and when a fault is detected, the power supply signals the presence of the fault and its location, e.g., by timed blinking of the connected discharge light. These features are enhanced by a diagnostic analyzer for connection to the power supply.