Patents by Inventor David Hui
David Hui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132474Abstract: Provided are compounds useful for treating of cancer and methods for treating of cancer, comprising administering to a subject in need thereof a compound described therein.Type: ApplicationFiled: May 8, 2023Publication date: April 25, 2024Inventors: Samuel V. Agresta, Chong-Hui Gu, David Schenkein, Hua Yang, Liting Guo, Zhen Tang, Jianming Wang, Yanfeng Zhang, Yan Zhou
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Publication number: 20240124467Abstract: Disclosed herein are heterocyclic compounds that inhibit the binding of menin and MLL or MLL fusion proteins. Also described are specific irreversible inhibitors of menin-MLL interaction. Also disclosed are pharmaceutical compositions that include the compounds. Methods of using the menin-MLL irreversible inhibitors are disclosed, alone or in combination with other therapeutic agents, for the treatment of autoimmune diseases or conditions, heteroimmune diseases or conditions, cancer, including lymphoma, leukemia and other diseases or conditions dependent on menin-MLL interaction.Type: ApplicationFiled: December 16, 2021Publication date: April 18, 2024Inventors: Thomas Butler, James T. PALMER, Thorsten KIRSCHBERG, Nan-Homg LIN, Hon HUI, Ravindra UPASANI, Solomon B. UNGASHE, David SPERANDIO
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Patent number: 11947915Abstract: A document is divided into sections based on a characteristic of the text in the document. Characteristics may include specific characters such as paragraph breaks or selected punctuation, the topics or categories of the text, or a quantity of text in each section. Each section of the document may be represented by an embedding vector in a semantic embedding space. Values are determined based on the text in each section and the semantic characteristics of each section, such as word order, capitalization, punctuation, and word meaning. When a query is received, a vector value representing the query is determined based on the text and semantic characteristics of the query. Based on the similarity between the values determined for the query and those determined for the sections of a document, the specific section of a potentially large document that most closely matches the query is determined and included in a response.Type: GrantFiled: April 23, 2021Date of Patent: April 2, 2024Inventors: Chia-Hui Shen, Suchit Agarwal, David Sung-Eun Lim, Pratyus Patnaik, Pierre Rappolt, Tanya Butani, William S. Potter
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Patent number: 11938179Abstract: Disclosed herein are methods and compositions for treating or preventing bacterial infection. In particular, the methods and compositions are directed towards C. difficile infection. In particular aspects, the compositions are vaccines containing multimeric polypeptides containing portions of multiple toxins from bacteria. The polypeptides induce effective immune responses thus treating or preventing infection.Type: GrantFiled: August 10, 2021Date of Patent: March 26, 2024Assignee: Novavax, Inc.Inventors: Jing-Hui Tian, Ye Liu, Gale Smith, Gregory Glenn, David Flyer
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Publication number: 20240061194Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include an interconnect die in a first layer surrounded by a dielectric material; a processor integrated circuit (processor IC) and an integrated circuit (IC) in a second layer, the second layer on the first layer, wherein the interconnect die is electrically coupled to the processor IC and the IC by first interconnects having a pitch of less than 10 microns between adjacent first interconnects; a photonic integrated circuit (PIC) and a substrate in a third layer, the third layer on the second layer, wherein the PIC has an active surface, and wherein the active surface of the PIC is coupled to the IC by second interconnects having a pitch of less than 10 microns between adjacent second interconnects; and a fiber connector optically coupled to the active surface of the PIC.Type: ApplicationFiled: August 19, 2022Publication date: February 22, 2024Applicant: Intel CorporationInventors: Adel A. Elsherbini, David Hui, Haris Khan Niazi, Wenhao Li, Bhaskar Jyoti Krishnatreya, Henning Braunisch, Shawna M. Liff, Jiraporn Seangatith, Johanna M. Swan, Krishna Vasanth Valavala, Xavier Francois Brun, Feras Eid
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Patent number: 11830863Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: GrantFiled: November 30, 2021Date of Patent: November 28, 2023Assignee: Intel CorporationInventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
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Publication number: 20220085001Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: November 30, 2021Publication date: March 17, 2022Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
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Patent number: 11217573Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: GrantFiled: March 4, 2020Date of Patent: January 4, 2022Assignee: Intel CorporationInventors: Suresh V. Pothukuchi, Andrew Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh Potluri, David M. Bond, Sushrutha Reddy Gujjula, Donald Tiendung Tran, David Hui, Vladimir Tamarkin
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Publication number: 20210407909Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.Type: ApplicationFiled: November 25, 2020Publication date: December 30, 2021Inventors: Susheel JADHAV, Kenneth BROWN, David HUI, Ling LIAO, Syed S. ISLAM
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Publication number: 20210320722Abstract: In one embodiment, an apparatus includes a processor, a laser, and a modulator. The processor is to generate a first electrical signal including first data and a second electrical signal including second data. The laser is to generate a multiplexed carrier signal comprising a first carrier signal and a second carrier signal, the laser to operate at a first laser power setting. The modulator is to generate a multiplexed optical signal including a first optical signal based in part on the first electrical signal and the first carrier signal and a second optical signal based in part on the second electrical signal and the second carrier signal. The apparatus is to transmit the multiplexed optical signal to a device and to retransmit the first data from the apparatus to the device based on a detection of error in a received version of the first data at the device. Other embodiments are described and claimed.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Inventors: Zuoguo Wu, Ling Liao, David Hui
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Publication number: 20210280566Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: March 4, 2020Publication date: September 9, 2021Inventors: Suresh V. POTHUKUCHI, Andrew ALDUINO, Ravindranath V. MAHAJAN, Srikant NEKKANTY, Ling LIAO, Harinadh POTLURI, David M. BOND, Sushrutha Reddy GUJJULA, Donald Tiendung TRAN, David HUI, Vladimir TAMARKIN
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Publication number: 20210210478Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.Type: ApplicationFiled: March 3, 2021Publication date: July 8, 2021Inventors: Susheel JADHAV, Juan DOMINGUEZ, Ankur AGRAWAL, Kenneth BROWN, Yi LI, Jing CHEN, Aditi MALLIK, Xiaoyu HONG, Thomas LILJEBERG, Andrew C. ALDUINO, Ling LIAO, David HUI, Ren-Kang CHIOU, Harinadh POTLURI, Hari MAHALINGAM, Lobna KAMYAB, Sasanka KANUPARTHI, Sushrutha Reddy GUJJULA, Saeed FATHOLOLOUMI, Priyanka DOBRIYAL, Boping XIE, Abiola AWUJOOLA, Vladimir TAMARKIN, Keith MEASE, Stephen KEELE, David SCHWEITZER, Brent ROTHERMEL, Ning TANG, Suresh POTHUKUCHI, Srikant NEKKANTY, Zhichao ZHANG, Kaiyuan ZENG, Baikuan WANG, Donald TRAN, Ravindranath MAHAJAN, Baris BICEN, Grant SMITH
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Publication number: 20210149115Abstract: The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 23, 2020Publication date: May 20, 2021Inventors: Duanni Huang, Saeed Fathololoumi, Meer Nazmus Sakib, Mohammad Montazeri Najafabadi, Chaoxuan Ma, David Hui, Taehwan Kim, Ling Liao, Hao Li, Ganesh Balamurugan, Haisheng Rong, Aliasghar Eftekhar
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Publication number: 20200371385Abstract: Embodiments of the present disclosure are directed to a photonic integrated circuit (PIC) that includes a micro-ring modulator (MRM) that is coupled with termination circuitry to reduce the reflection coefficient of the MRM when the PIC is electrically coupled to a driver. In embodiments, the termination circuitry may include one or more passive elements. Other embodiments may be described and/or claimed.Type: ApplicationFiled: August 12, 2020Publication date: November 26, 2020Inventors: Siamak Amiralizadeh Asl, David Hui, Sanjeev Gupta
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Publication number: 20200353431Abstract: A functional water producing apparatus in an embodiment includes: a water pressure regulator configured to regulate the water pressure of the ultrapure water, the water pressure regulator having a pressure regulating valve configured to regulate a water pressure of the ultrapure water to an almost constant pressure and a feed water pump configured to pressurize the ultrapure water; a dissolving device configured to dissolve functional gas imparting a specific function in the ultrapure water regulated the water pressure by the water pressure regulator; and a control device configured to control the feed water pump to regulate the water pressure of the functional water to a predetermined constant pressure based on a water pressure or a flow rate of the functional water flowing out of the dissolving device.Type: ApplicationFiled: April 7, 2020Publication date: November 12, 2020Applicants: NOMURA MICRO SCIENCE CO., LTD., ACM RESEARCH (SHANGHAI), INC.Inventors: Takayuki JIZAIMARU, David Hui WANG
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Patent number: 10764161Abstract: The present disclosure relates to a method for traffic engineering in a communications network. In one example method, a controller determines at least one sampling node in a flexible node and a temporal frequency for traffic sampling. The controller instruct the at least one sampling node to perform traffic sampling at the temporal frequency. The controller receives sampled traffic data of all sampling nodes obtained during each sampling. The controller determines, according to the sampled traffic data obtained during each sampling and information about total traffic of a link whose link utilization is greater than a first preset value or less than a second preset value in the communications network, parameter information for traffic engineering. The controller performs traffic engineering control according to the parameter information.Type: GrantFiled: August 3, 2018Date of Patent: September 1, 2020Assignee: Huawei Technologies Co., Ltd.Inventors: Shui Wing David Hui, Gong Zhang
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Patent number: 10654014Abstract: A functional water producing apparatus in an embodiment includes: a water pressure regulator configured to regulate the water pressure of the ultrapure water, the water pressure regulator having a pressure regulating valve configured to regulate a water pressure of the ultrapure water to an almost constant pressure and a feed water pump configured to pressurize the ultrapure water; a dissolving device configured to dissolve functional gas imparting a specific function in the ultrapure water regulated the water pressure by the water pressure regulator; and a control device configured to control the feed water pump to regulate the water pressure of the functional water to a predetermined constant pressure based on a water pressure or a flow rate of the functional water flowing out of the dissolving device.Type: GrantFiled: January 27, 2017Date of Patent: May 19, 2020Assignees: NOMURA MICRO SCIENCE CO., LTD., ACM RESEARCH (SHANGHAI), INC.Inventors: Takayuki Jizaimaru, David Hui Wang
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Publication number: 20190010974Abstract: An elongated sleeve for anti-corrosion and decoration includes: a sleeve member having a socket formed therein; and an anti-corrosion lining member ratchetedly or irreversibly fixed in the socket of the sleeve member and operatively engaged with a wheel nut or a lug bolt secured on a wheel disk or cover, to thereby prevent corrosion between the sleeve member and the wheel nut or bolt as packed by the lining member between the nut or bolt and the sleeve member.Type: ApplicationFiled: December 5, 2017Publication date: January 10, 2019Inventor: David Hui
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Publication number: 20180343176Abstract: The present disclosure relates to a method for traffic engineering in a communications network. In one example method, a controller determines at least one sampling node in a flexible node and a temporal frequency for traffic sampling. The controller instruct the at least one sampling node to perform traffic sampling at the temporal frequency. The controller receives sampled traffic data of all sampling nodes obtained during each sampling. The controller determines, according to the sampled traffic data obtained during each sampling and information about total traffic of a link whose link utilization is greater than a first preset value or less than a second preset value in the communications network, parameter information for traffic engineering. The controller performs traffic engineering control according to the parameter information.Type: ApplicationFiled: August 3, 2018Publication date: November 29, 2018Inventors: Shui Wing David HUI, Gong ZHANG
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Publication number: 20170305383Abstract: An inflator cap comprising: an outer cover; an anti-corrosion lining formed in or inside the outer cover; and a magnetic member formed on, in or inside the outer cover, whereby the magnetic member of the inflator cap, once unscrewed from the inflator, will be magnetically attractable on a ferromagnetic object to prevent its loss; or whereby the anti-corrosion lining will preclude a direct contact between the outer cover of the inflator cap and a valve stem of the inflator to prevent from sticking of the oxide of the outer cover once oxidized on the valve stem of the inflator, thereby smoothly unscrewing the cap from the inflator.Type: ApplicationFiled: April 24, 2016Publication date: October 26, 2017Inventor: David Hui