Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include an interconnect die in a first layer surrounded by a dielectric material; a processor integrated circuit (processor IC) and an integrated circuit (IC) in a second layer, the second layer on the first layer, wherein the interconnect die is electrically coupled to the processor IC and the IC by first interconnects having a pitch of less than 10 microns between adjacent first interconnects; a photonic integrated circuit (PIC) and a substrate in a third layer, the third layer on the second layer, wherein the PIC has an active surface, and wherein the active surface of the PIC is coupled to the IC by second interconnects having a pitch of less than 10 microns between adjacent second interconnects; and a fiber connector optically coupled to the active surface of the PIC.

Abstract: In one embodiment, an apparatus includes a processor, a laser, and a modulator. The processor is to generate a first electrical signal including first data and a second electrical signal including second data. The laser is to generate a multiplexed carrier signal comprising a first carrier signal and a second carrier signal, the laser to operate at a first laser power setting. The modulator is to generate a multiplexed optical signal including a first optical signal based in part on the first electrical signal and the first carrier signal and a second optical signal based in part on the second electrical signal and the second carrier signal. The apparatus is to transmit the multiplexed optical signal to a device and to retransmit the first data from the apparatus to the device based on a detection of error in a received version of the first data at the device. Other embodiments are described and claimed.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.

Abstract: The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include an interconnect die in a first layer surrounded by a dielectric material; a processor integrated circuit (processor IC) and an integrated circuit (IC) in a second layer, the second layer on the first layer, wherein the interconnect die is electrically coupled to the processor IC and the IC by first interconnects having a pitch of less than 10 microns between adjacent first interconnects; a photonic integrated circuit (PIC) and a substrate in a third layer, the third layer on the second layer, wherein the PIC has an active surface, and wherein the active surface of the PIC is coupled to the IC by second interconnects having a pitch of less than 10 microns between adjacent second interconnects; and a fiber connector optically coupled to the active surface of the PIC.

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.

Abstract: In one embodiment, an apparatus includes a processor, a laser, and a modulator. The processor is to generate a first electrical signal including first data and a second electrical signal including second data. The laser is to generate a multiplexed carrier signal comprising a first carrier signal and a second carrier signal, the laser to operate at a first laser power setting. The modulator is to generate a multiplexed optical signal including a first optical signal based in part on the first electrical signal and the first carrier signal and a second optical signal based in part on the second electrical signal and the second carrier signal. The apparatus is to transmit the multiplexed optical signal to a device and to retransmit the first data from the apparatus to the device based on a detection of error in a received version of the first data at the device. Other embodiments are described and claimed.

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Abstract: The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed to a photonic integrated circuit (PIC) that includes a micro-ring modulator (MRM) that is coupled with termination circuitry to reduce the reflection coefficient of the MRM when the PIC is electrically coupled to a driver. In embodiments, the termination circuitry may include one or more passive elements. Other embodiments may be described and/or claimed.

Abstract: An elongated sleeve for anti-corrosion and decoration includes: a sleeve member having a socket formed therein; and an anti-corrosion lining member ratchetedly or irreversibly fixed in the socket of the sleeve member and operatively engaged with a wheel nut or a lug bolt secured on a wheel disk or cover, to thereby prevent corrosion between the sleeve member and the wheel nut or bolt as packed by the lining member between the nut or bolt and the sleeve member.

Abstract: An inflator cap comprising: an outer cover; an anti-corrosion lining formed in or inside the outer cover; and a magnetic member formed on, in or inside the outer cover, whereby the magnetic member of the inflator cap, once unscrewed from the inflator, will be magnetically attractable on a ferromagnetic object to prevent its loss; or whereby the anti-corrosion lining will preclude a direct contact between the outer cover of the inflator cap and a valve stem of the inflator to prevent from sticking of the oxide of the outer cover once oxidized on the valve stem of the inflator, thereby smoothly unscrewing the cap from the inflator.

Abstract: An inflator cap comprising: an outer cover; an anti-corrosion lining formed in or inside the outer cover; and a magnetic member formed on, in or inside the outer cover, whereby the magnetic member of the inflator cap, once unscrewed from the inflator, will be magnetically attractable on a ferromagnetic object to prevent its loss; or whereby the anti-corrosion lining will preclude a direct contact between the outer cover of the inflator cap and a valve stem of the inflator to prevent from sticking of the oxide of the outer cover once oxidized on the valve stem of the inflator, thereby smoothly unscrewing the cap from the inflator.

Abstract: A multiple-in-one socket includes a socket body having a first gradational cavity recessed in a first end of the socket body, and a second gradational cavity recessed in a second end of the socket body opposite to the first gradational cavity; each gradational cavity including a plurality of polygonal holes gradationally contracted in sizes inwardly from an outermost hole towards an innermost hole; whereby a plurality of polygonal holes having plurality of hole sizes may be conveniently chosen for fastening a bolt or nut by correspondingly matching the bolt (or nut) size with the polygonal-hole size.

Abstract: A multiple-in-one socket includes a socket body having a first gradational cavity recessed in a first end of the socket body, and a second gradational cavity recessed in a second end of the socket body opposite to the first gradational cavity; each gradational cavity including a plurality of polygonal holes gradationally contracted in sizes inwardly from an outermost hole towards an innermost hole; whereby a plurality of polygonal holes having plurality of hole sizes may be conveniently chosen for fastening a bolt or nut by correspondingly matching the bolt (or nut) size with the polygonal-hole size.

Abstract: A LED lighting system includes: a power unit for providing a power supply source for the lighting system, a LED circuit connected to the power unit for illuminating the light emitting diodes of the LED circuit, a heat control unit connected between the power unit and the LED circuit for controlling heat as produced, and a heat dissipating device thermally connected to the heat control unit for outwardly dissipating the heat produced by the lighting system for preventing light attenuation or damage of the light emitting diodes.