Abstract: A laser assembly including a diamond film submount is formed by anisotropically etching a localized indentation (recess) region in an originally completely planar face of the film. The region has one or pair of intersecting sidewalls preferably making the same angle between them as an angle made between a pair of sides of a laser device. After metallizing the remaining top face of the film, the bottom of the indentation region, and one or both of the sidewalls of the indentation region, the laser device is pushed into position in the recess with its above-mentioned pair of sides lying against one of the sidewalls and the metallization of the other sidewall, or lying against the metallization of both sidewalls; and the bottom of the laser device is quickly bonded by means of solder to the metallization on the bottom of the recess.