Abstract: A process for stripping the outer edge of a bonded BESOI wafer. The bonded BESOI wafer comprises a handle wafer, an oxide layer on one surface of the handle wafer, a device layer bonded to the oxide layer, and a p.sup.+ etch-stop layer on the device layer having an exposed face. The process comprises masking the exposed face of the p.sup.+ etch-stop layer, and abrading the periphery of the BESOI wafer to remove edge margins of the p.sup.+ etch-stop layer and device layer.

Abstract: A process for stripping the outer edge of a bonded BESOI wafer. The bonded BESOI wafer comprises a handle wafer, an oxide layer on one surface of the handle wafer, a device layer bonded to the oxide layer, and a p.sup.+ etch-stop layer on the device layer having an exposed face. The process comprises masking the exposed face of the p.sup.+ etch-stop layer, and abrading the periphery of the BESOI wafer to remove edge margins of the p.sup.+ etch-stop layer and device layer.

Abstract: A semiconductor wafer polisher of the present invention for polishing at least one semiconductor wafer to flatten a first face of the wafer and reduce the thickness of the wafer from an initial thickness t.sub.1 to a predetermined final thickness t.sub.2. The polisher comprises a first surface including a polishing surface portion, a second surface including a second surface portion, and a wafer carrier for holding the semiconductor wafer between the polishing surface portion and the second surface portion. At least one polishing limiter is between the first and second surfaces for limiting the reduction in thickness of the wafer. The wafer carrier and polishing limiter are integrally formed such that the polishing limiter and wafer carrier constitute a single unitary piece.

Abstract: A method for producing steel filaments having a heat treated microstructure is disclosed. The method comprises the steps of providing a steel coil having a carbon content from about 0.30 to about 0.95, percent by weight, scoring the surface of the steel to form a plurality of grooves that delineate continuous longitudinal segments, heat treating the steel to develop an appropriate metallurgical structure, separating the segments into individual filaments by causing the steel to fracture at the grooves, and then passing the filaments through a mechanical straightener.

Abstract: A method for producing wire with a small cross-sectional area and good mechanical properties is disclosed. The method comprises the steps of providing metallic coil stock of blackplate thickness with a specific microstructure and an essentially uniform cross-section, positioning in engaging relationship a pair of monolithic cutting rolls, feeding the stock into the nip formed by the rolls and then slitting the stock by shear fracture into wire with an aspect ratio of less than about 25. The method is characterized by an extended life of the cutting rolls.

Abstract: An improved method for continuously carburizing low carbon cold rolled coil stock is disclosed. The carburized product is characterized by the absence of proeutectoid ferrite. The method comprises heating low carbon steel stock in the austenitizing range of 950.degree.-1150.degree.C. (1750.degree.-2100.degree.F.) in a continuous heat treating furnace wherein the furnace contains a high carbon availability so that residence time is of a short duration; homogenizing the stock so as to attain uniform macro distribution of carbon across the length, width and thickness of the stock and quenching the stock so that a uniform micro distribution of carbon is attained.