Patents by Inventor David I-Keong Wong

David I-Keong Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11671330
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n-1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: June 6, 2023
    Inventor: David I-Keong Wong
  • Publication number: 20230052529
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n-1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 16, 2023
    Inventor: David I-Keong Wong
  • Patent number: 11509538
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n?1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: November 22, 2022
    Inventor: David I-Keong Wong
  • Publication number: 20210320846
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n?1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 14, 2021
    Inventor: David I-Keong Wong
  • Patent number: 11070437
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n?1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: July 20, 2021
    Inventor: David I-Keong Wong
  • Publication number: 20200336386
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n?1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventor: David I-Keong Wong
  • Patent number: 10742513
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n?1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: August 11, 2020
    Inventor: David I-Keong Wong
  • Patent number: 10477288
    Abstract: An interconnect module (“ICAS module”) includes n optical data ports each comprising n optical interfaces, and an interconnecting network implementing a full mesh topology for interconnecting the optical interfaces of each port each to a respective one of the optical interfaces of each of the other ports. In one embodiment, each optical interface exchanges data signals over a communication medium with optical transceiver. The interconnecting module may implement the full mesh topology using optical fibers. The interconnecting module may be used to replace fabric switches as well as a building block for a spine switch.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: November 12, 2019
    Inventor: David I-Keong Wong
  • Publication number: 20190245751
    Abstract: An interconnect as a switch module (“ICAS” module) comprising n port groups, each port group comprising n?1 interfaces, and an interconnecting network implementing a full mesh topology where each port group comprising a plurality of interfaces each connects an interface of one of the other port groups, respectively. The ICAS module may be optically or electrically implemented. According to the embodiments, the ICAS module may be used to construct a stackable switching device and a multi-unit switching device, to replace a data center fabric switch, and to build a new, high-efficient, and cost-effective data center.
    Type: Application
    Filed: January 25, 2019
    Publication date: August 8, 2019
    Inventor: David I-Keong Wong
  • Publication number: 20190246187
    Abstract: An interconnect module (“ICAS module”) includes n optical data ports each comprising n optical interfaces, and an interconnecting network implementing a full mesh topology for interconnecting the optical interfaces of each port each to a respective one of the optical interfaces of each of the other ports. In one embodiment, each optical interface exchanges data signals over a communication medium with optical transceiver. The interconnecting module may implement the full mesh topology using optical fibers. The interconnecting module may be used to replace fabric switches as well as a building block for a spine switch.
    Type: Application
    Filed: February 5, 2018
    Publication date: August 8, 2019
    Inventor: David I-Keong Wong
  • Patent number: 5862067
    Abstract: A method and apparatus for combining at least two packed multiply-accumulate instructions (or equivalent operations) to compute a filter result from coefficients having more bits than can be processed by a single multiply-accumulate instruction (or equivalent operation). This achieves greater accuracy in computing transforms and digital filters without requiring more expensive hardware to implement multiply-accumulate instructions for larger operands. Typical applications are compression/decompression algorithms, modem, audio and video. The invention is scalable, permitting additional multiply-accumulate instructions to be added as incrementally larger coefficients are required. Additionally, the invention permits different numbers of multiply-accumulate instructions for each coefficient depending on the sensitivity to that particular coefficient.
    Type: Grant
    Filed: December 29, 1995
    Date of Patent: January 19, 1999
    Assignee: Intel Corporation
    Inventors: Larry M. Mennemeier, David I-Keong Wong