Abstract: A kit and method for assembling a decorative object pattern upon a fabric article including a flat, smooth surface board, a desired number of individual stencil units, slidably situated upon the board, and held movably in place by magnetic force. The stencil units are arranged upon the board surface to create a desired stencil design. Rhinestones or other decorative objects are situated within the stencil pattern with their adhesive side down. An adhesive backed cover sheet is provided to hold the decorative object pattern in place. The cover sheet is adapted to being placed on the fabric surface, and the held objects adhered thereto.

Abstract: The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed circuit boards.

Abstract: An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on a substrate circuit board, and a composite material underfilling, overmolding or encapsulating the electronic device, wherein the composite material includes a thermoset matrix phase and a discontinuous liquid crystal polymer phase dispersed throughout the thermoset matrix phase.

Abstract: A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.