Patents by Inventor David J. Bajkowski

David J. Bajkowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing flex circuit with selectively plated gold
    Patent number: 6515233
    Abstract: Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment sites, such as wire bond pads or ball grid array pads, for semiconductor chips. This method eliminates the requirement to buss all circuits to a common plating contact by using a background seed metal for plating continuity. This method also provides a means to alleviate the requirement for precise registration or alignment when multiple photoresist layers are employed in order to selectively plate only a portion of the metallic elements present on the flexible circuit board. The defect of resist lifting followed by nickel/gold underplating is eliminated by conditioning the intermediate photoresist to survive the nickel/gold plating bath.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: February 4, 2003
    Inventors: Daniel P. Labzentis, Francesco F. Marconi, Allan R. Knoll, David J. Bajkowski
  • Method of producing flex circuit with selectively plated gold
    Patent number: 6383401
    Abstract: Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment sites, such as wire bond pads or ball grid array pads, for semiconductor chips. This method eliminates the requirement to buss all circuits to a common plating contact by using a background seed metal for plating continuity. This method also provides a means to alleviate the requirement for precise registration or alignment when multiple photoresist layers are employed in order to selectively plate only a portion of the metallic elements present on the flexible circuit board. The defect of resist lifting followed by nickel/gold underplating is eliminated by conditioning the intermediate photoresist to survive the nickel/gold plating bath.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: May 7, 2002
    Assignee: International Flex Technologies, Inc.
    Inventors: Daniel P. Labzentis, Francesco F. Marconi, Allan R. Knoll, David J. Bajkowski