Patents by Inventor David J. Bouwkamp

David J. Bouwkamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10342167
    Abstract: A rearview assembly having a circuit board. A grounded heat sink is proximate the circuit board. A thermal pad is disposed between and in abutting contact with the circuit board and the grounded heat sink. An electromagnetic shield includes a plurality of spring tabs disposed about a periphery of the electromagnetic shield.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: July 2, 2019
    Assignee: GENTEX CORPORATION
    Inventor: David J. Bouwkamp
  • Publication number: 20180124958
    Abstract: A rearview assembly having a circuit board. A grounded heat sink is proximate the circuit board. A thermal pad is disposed between and in abutting contact with the circuit board and the grounded heat sink. An electromagnetic shield includes a plurality of spring tabs disposed about a periphery of the electromagnetic shield.
    Type: Application
    Filed: November 1, 2017
    Publication date: May 3, 2018
    Applicant: Gentex Corporation
    Inventor: David J. Bouwkamp