Patents by Inventor David J. Camelio
David J. Camelio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9705240Abstract: A vibration resistant connector is disclosed. The connector employs a friction member to create a resistance between a coupling nut of the connector and a connector body of the connector that is disposed in a cavity formed by the coupling nut. In some embodiments, the friction member is in the form of an O-ring that encircles a portion of the connector body and that is compressed by the coupling nut.Type: GrantFiled: May 18, 2016Date of Patent: July 11, 2017Assignee: Winchester Electronics CorporationInventors: John E. Benham, David J. Camelio
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Publication number: 20170077642Abstract: A vibration resistant connector is disclosed. The connector employs a friction member to create a resistance between a coupling nut of the connector and a connector body of the connector that is disposed in a cavity formed by the coupling nut. In some embodiments, the friction member is in the form of an O-ring that encircles a portion of the connector body and that is compressed by the coupling nut.Type: ApplicationFiled: May 18, 2016Publication date: March 16, 2017Applicant: Winchester Electronics CorporationInventors: John E. BENHAM, David J. CAMELIO
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Patent number: 9553400Abstract: A vibration resistant connector is disclosed. The connector employs a friction member to create a resistance between a coupling nut of the connector and a connector body of the connector that is disposed in a cavity formed by the coupling nut. In some embodiments, the friction member is in the form of an O-ring that encircles a portion of the connector body and that is compressed by the coupling nut.Type: GrantFiled: September 11, 2015Date of Patent: January 24, 2017Assignee: Winchester Electronics CorporationInventors: John E. Benham, David J. Camelio
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Patent number: 9039424Abstract: The present invention provides a DIN jack including a dielectric shroud defining a closed entry lead-in that helps prevent damage caused by a bent or misaligned signal pin of a mating DIN plug without adversely affecting the performance of the DIN connector. The present invention also provides a board lock feature that may be used to hold a DIN jack securely to a circuit board during the manufacturing process.Type: GrantFiled: October 19, 2012Date of Patent: May 26, 2015Assignee: Winchester Electronics CorporationInventors: David J. Camelio, John E. Benham
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Publication number: 20140120785Abstract: In one aspect, a method for securing a signal conductor to a contact is provided. The method includes obtaining a contact having a first end and a second end, wherein the second end comprises a crimp area having a wall that defines a cavity and a plurality of cold flow holes are formed in the wall and surround at least a portion of the cavity; inserting an end of the signal conductor into the cavity; and after inserting the end of the signal conductor into the cavity, crimping the crimp area so that the signal conductor cold flows into at least one of the cold flow holes.Type: ApplicationFiled: October 24, 2013Publication date: May 1, 2014Applicant: Winchester Electronics CorporationInventors: John E. BENHAM, David J. CAMELIO
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Patent number: 8157572Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.Type: GrantFiled: February 17, 2011Date of Patent: April 17, 2012Assignee: Winchester Electronics CorporationInventors: John E. Benham, David J. Camelio
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Publication number: 20110217871Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.Type: ApplicationFiled: February 17, 2011Publication date: September 8, 2011Applicant: WINCHESTER ELECTRONICS CORPORATIONInventors: John E. BENHAM, David J. CAMELIO
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Patent number: 7896656Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.Type: GrantFiled: November 19, 2009Date of Patent: March 1, 2011Assignee: Winchester Electronics CorporationInventors: John E. Benham, David J. Camelio
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Patent number: 7699617Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.Type: GrantFiled: October 8, 2008Date of Patent: April 20, 2010Assignee: Winchester Electronics CorporationInventors: John E. Benham, David J. Camelio
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Publication number: 20100062638Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.Type: ApplicationFiled: November 19, 2009Publication date: March 11, 2010Applicant: Winchester Electronics CorporationInventors: John E. BENHAM, David J. CAMELIO
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Publication number: 20090093138Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.Type: ApplicationFiled: October 8, 2008Publication date: April 9, 2009Applicant: WINCHESTER ELECTRONICS CORPORATIONInventors: John E. BENHAM, David J. CAMELIO
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Patent number: 7513788Abstract: The invention relates to a connector that can be easily mated to a jack connector.Type: GrantFiled: December 20, 2007Date of Patent: April 7, 2009Assignee: Winchester Electronics CorporationInventor: David J. Camelio
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Patent number: 7322846Abstract: The invention relates to a connector that can be easily mated to a jack connector.Type: GrantFiled: November 1, 2006Date of Patent: January 29, 2008Assignee: Winchester Electronics CorporationInventor: David J. Camelio