Patents by Inventor David J. Camelio

David J. Camelio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9705240
    Abstract: A vibration resistant connector is disclosed. The connector employs a friction member to create a resistance between a coupling nut of the connector and a connector body of the connector that is disposed in a cavity formed by the coupling nut. In some embodiments, the friction member is in the form of an O-ring that encircles a portion of the connector body and that is compressed by the coupling nut.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: July 11, 2017
    Assignee: Winchester Electronics Corporation
    Inventors: John E. Benham, David J. Camelio
  • Publication number: 20170077642
    Abstract: A vibration resistant connector is disclosed. The connector employs a friction member to create a resistance between a coupling nut of the connector and a connector body of the connector that is disposed in a cavity formed by the coupling nut. In some embodiments, the friction member is in the form of an O-ring that encircles a portion of the connector body and that is compressed by the coupling nut.
    Type: Application
    Filed: May 18, 2016
    Publication date: March 16, 2017
    Applicant: Winchester Electronics Corporation
    Inventors: John E. BENHAM, David J. CAMELIO
  • Patent number: 9553400
    Abstract: A vibration resistant connector is disclosed. The connector employs a friction member to create a resistance between a coupling nut of the connector and a connector body of the connector that is disposed in a cavity formed by the coupling nut. In some embodiments, the friction member is in the form of an O-ring that encircles a portion of the connector body and that is compressed by the coupling nut.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: January 24, 2017
    Assignee: Winchester Electronics Corporation
    Inventors: John E. Benham, David J. Camelio
  • Patent number: 9039424
    Abstract: The present invention provides a DIN jack including a dielectric shroud defining a closed entry lead-in that helps prevent damage caused by a bent or misaligned signal pin of a mating DIN plug without adversely affecting the performance of the DIN connector. The present invention also provides a board lock feature that may be used to hold a DIN jack securely to a circuit board during the manufacturing process.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: May 26, 2015
    Assignee: Winchester Electronics Corporation
    Inventors: David J. Camelio, John E. Benham
  • Publication number: 20140120785
    Abstract: In one aspect, a method for securing a signal conductor to a contact is provided. The method includes obtaining a contact having a first end and a second end, wherein the second end comprises a crimp area having a wall that defines a cavity and a plurality of cold flow holes are formed in the wall and surround at least a portion of the cavity; inserting an end of the signal conductor into the cavity; and after inserting the end of the signal conductor into the cavity, crimping the crimp area so that the signal conductor cold flows into at least one of the cold flow holes.
    Type: Application
    Filed: October 24, 2013
    Publication date: May 1, 2014
    Applicant: Winchester Electronics Corporation
    Inventors: John E. BENHAM, David J. CAMELIO
  • Patent number: 8157572
    Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: April 17, 2012
    Assignee: Winchester Electronics Corporation
    Inventors: John E. Benham, David J. Camelio
  • Publication number: 20110217871
    Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.
    Type: Application
    Filed: February 17, 2011
    Publication date: September 8, 2011
    Applicant: WINCHESTER ELECTRONICS CORPORATION
    Inventors: John E. BENHAM, David J. CAMELIO
  • Patent number: 7896656
    Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: March 1, 2011
    Assignee: Winchester Electronics Corporation
    Inventors: John E. Benham, David J. Camelio
  • Patent number: 7699617
    Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: April 20, 2010
    Assignee: Winchester Electronics Corporation
    Inventors: John E. Benham, David J. Camelio
  • Publication number: 20100062638
    Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.
    Type: Application
    Filed: November 19, 2009
    Publication date: March 11, 2010
    Applicant: Winchester Electronics Corporation
    Inventors: John E. BENHAM, David J. CAMELIO
  • Publication number: 20090093138
    Abstract: The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts.
    Type: Application
    Filed: October 8, 2008
    Publication date: April 9, 2009
    Applicant: WINCHESTER ELECTRONICS CORPORATION
    Inventors: John E. BENHAM, David J. CAMELIO
  • Patent number: 7513788
    Abstract: The invention relates to a connector that can be easily mated to a jack connector.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: April 7, 2009
    Assignee: Winchester Electronics Corporation
    Inventor: David J. Camelio
  • Patent number: 7322846
    Abstract: The invention relates to a connector that can be easily mated to a jack connector.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: January 29, 2008
    Assignee: Winchester Electronics Corporation
    Inventor: David J. Camelio