Abstract: A dual pivot game controller including two rotating assemblies, one for each of a user's two hands, is described. Each of the two rotating assemblies is coupled to a base by a pivoting coupling, and each pivoting coupling includes an axis of rotation about which its respective rotating assembly rotates. Accordingly, each rotating assembly and pivoting coupling share an axes of rotation, and each rotating assembly is thus configured to rotate relative to the base to which it is coupled. The axes of rotation usually reside in a common plane and are substantially non-parallel, such that they intersect at an axes intersection angle. An axes intersection angle of about 52° is typical. The two rotating assemblies are usually operationally coupled to each other such that they rotate in tandem during use.

Abstract: A dual pivot game controller including two rotating assemblies, one for each of a user's two hands, is described. Each of the two rotating assemblies is coupled to a base by a pivoting coupling, and each pivoting coupling includes an axis of rotation about which its respective rotating assembly rotates. Accordingly, each rotating assembly and pivoting coupling share an axes of rotation, and each rotating assembly is thus configured to rotate relative to the base to which it is coupled. The axes of rotation usually reside in a common plane and are substantially non-parallel, such that they intersect at an axes intersection angle. An axes intersection angle of about 52° is typical. The two rotating assemblies are usually operationally coupled to each other such that they rotate in tandem during use.

Abstract: An integrated step attenuator (“ISA”) monolithically integrated on a single chip for adjusting an input signal. The ISA may include a step attenuation network (“SAN”) that may include at least one switchable attenuation section, and at least one electronically switchable trimming network (“ESTN”). The SAN may be configured to adjust the input signal responsive to the state of a switch that bridges the attenuation sections of the SAN, and the ESTN may be configured to adjust the input signal responsive to the state of a switch in signal communication with one or more shunt resistors in the ESTN.

Abstract: A micro-browser has pair of rods each rod entering a corresponding bore in a sleeve that retains them, and that may itself be carried by a grip shaped to be rotated between a thumb and a finger. The edge of a small circuit board is soldered at the distal end of the rod. One of the rods is allowed to rotate within its bore in the sleeve, while the other is held stationary by a notch in the sleeve. The rotatable rod has a captive spring that resists the force of probe contact. Each board carries a coupling network connected to a short sharp probe tip bent downward away from the plane of its board, allowing the distance between the probe tips to be a function of the amount of rotation. The other end of each coupling network is coupled to a short length of a respective 50 ? coaxial cable that passes through an axial slot in the grip to enter an amplifier pod that drives a main cable leading to test equipment. The rods may be held within the bores by friction created by slight bends in the rods.

Abstract: A resistive pin for use in a voltage probe includes a pin-head that is configured to contact a test point in a device under test, and a resistor that is attached to the pin-head. Other systems are also provided for establishing electrical connections between testing instruments and devices under test.

Abstract: A resistive pin for use in a voltage probe includes a pin-head that is configured to contact a test point in a device under test, and a resistor that is attached to the pinhead. Other systems are also provided for establishing electrical connections between testing instruments and devices under test.

Abstract: Resonance within an attenuator relay caused by stray coupling capacitances to, and stray reactance within the switched conductor that replaces the attenuator section, is mitigated by reducing the stray coupling capacitances to as low a value as possible, and by using a conductor that is a section of controlled impedance transmission line that matches the system into which the attenuator relay has been placed. A substrate having SPDT LIMMS switches on either side of a switched transmission line segment and its associated attenuator, all of which are fabricated on the substrate, will have significantly lower stray coupling capacitance across the open parts of the switches when the attenuator segment is in use. This will increase the frequency for the onset of the resonance driven by the RF voltage drop across the attenuator. A reduction in the amplitude of the resonance can be obtained by including on the substrate an additional pair of LIMMS damping switches at each end of the transmission line segment.

Abstract: Resonance within an attenuator relay caused by stray coupling capacitances to, and stray reactance within the switched conductor that replaces the attenuator section, is mitigated by reducing the stray coupling capacitances to as low a value as possible, and by using a conductor that is a section of controlled impedance transmission line that matches the system into which the attenuator relay has been placed. A substrate having SPDT LIMMS switches on either side of a switched transmission line segment and its associated attenuator, all of which are fabricated on the substrate, will have significantly lower stray coupling capacitance across the open parts of the switches when the attenuator segment is in use. This will increase the frequency for the onset of the resonance driven by the RF voltage drop across the attenuator. A reduction in the amplitude of the resonance can be obtained by including on the substrate an additional pair of LIMMS damping switches at each end of the transmission line segment.

Abstract: A probe head includes analog amplifier inputs, a ground plane, and hundreds of probe leads between the inputs and the pins of a circuit under test. The customer defines the grounded pins of the circuit under test. Non-active probe leads, i.e. leads corresponding to the grounded pins are connected to the ground plane, maximizing the connections between the grounds of the probe and the circuit under test and minimizing unequal ground potentials. The probe circuit is on a probe circuit board, while the connections between the ground plane and the leads are fusible elements on a separate ground personality board. The probe is placed on a simulated circuit under test, the grounded pins on the circuit under test are protected by an insulating cap, and a voltage is placed on the remainder of the pins to fuse the elements corresponding the active probe leads.

Abstract: A probe head includes analog amplifier inputs, a ground plane, and hundreds of probe leads between the inputs and the pins of a circuit under test. The customer defines the grounded pins of the circuit under test. Non-active probe leads, i.e. leads corresponding to the grounded pins are connected to the ground plane, maximizing the connections between the grounds of the probe and the circuit under test and minimizing unequal ground potentials. The probe circuit is on a probe circuit board, while the connections between the ground plane and the leads are fusible elements on a separate ground personality board. The probe is placed on a simulated circuit under test, the grounded pins on the circuit under test are protected by an insulating cap, and a voltage is placed on the remainder of the pins to fuse the elements corresponding the active probe leads.

Abstract: A probe head includes analog amplifier inputs, a ground plane, and hundreds of probe leads between the inputs and the pins of a circuit under test. The customer defines the grounded pins of the circuit under test. Non-active probe leads, i.e. leads corresponding to the grounded pins are connected to the ground plane, maximizing the connections between the grounds of the probe and the circuit under test and minimizing unequal ground potentials. The probe circuit is on a probe circuit board, while the connections between the ground plane and the leads are fusible elements on a separate ground personality board. The probe is placed on a simulated circuit under test, the grounded pins on the circuit under test are protected by an insulating cap, and a voltage is placed on the remainder of the pins to fuse the elements corresponding the active probe leads.

Abstract: An analog electronic test probe includes hundreds of inputs each connected to two amplifiers, each in a separate multiplexer stage on an integrated circuit. A programmer, responsive to a dial, shifts data through a shift register of latches each of which is connected to one of the amplifiers, activating the amplifier(s) connected to the selected input, thereby multiplexing it (them) to selected output(s). Similarly, the gain for each output may be selected. An outdisable circuit connected to the outputs of each multiplexer and the outputs of each IC chip causes each output to appear electrically as an open circuit when no input associated with the multiplexer or chip is selected. This permits any number of multiplexers and IC chips to be daisy-chained together.

Abstract: A probe head includes integrated circuit chip inputs, a ground plane on a circuit board, and hundreds of probe leads comprising traces on the circuit board connected between the inputs and a circuit under test. Each trace is about 3 mils wide. There is a DICLAD polytetrafluoroethylene dielectric material of dielectric constant of about 2.2 between the ground and traces. Every other trace is electrically connected to the ground plane. Input resistors are buried in the circuit board and there is an on-chip input divider network. The customer defines the grounded pins of a circuit to be tested. Probe leads corresponding to the grounded pins are connected to the ground plane, maximizing the connections between the grounds of the probe and the circuit under test and minimizing unequal ground potentials.

Abstract: An analog test probe includes an integrated circuit having a large number of separate channels, each connected to one of its inputs. There is a plurality of probe tips and 100 ohm coaxial cables, each cable connecting one of said probe tips and one of the IC inputs. This structure introduces reverse signals into the channels that would seriously degrade probe operation if not removed. A capacitor and resistor in each probe tip, and in series with the coaxial cable and ground, match the impedance of the coaxial cable in the reverse direction, so that reverse signals are dissipated in the resistance and capacitance and do not reflect into the probe channels.