Abstract: An external cavity diode laser has been developed to achieve a linear frequency chirp over a broad bandwidth using a silicon photonic filter chip as the external cavity. By appropriately chirping the cavity phase using the gain chip and/or a cavity phase modulator on the silicon photonic chip along with simultaneously varying the filter resonance, approximately linear frequency chirping can be accomplished for at least 50 GHz, although desirable structures with useful lesser chirp bandwidths are also described. With careful control of the chip design, it is possible to achieve predictable behavior of mode jumps along with large scannable ranges within a mode, which allows for stitching together segments of linear chirp through a mode jump to provide for very large chirp bandwidths greater than 1 THz.

Abstract: Devices are provided to perform imaging using laser light based on scanning without any mechanically moving parts to obtain a scan over the field of view. An optical chip comprises a row of selectable emitting elements comprising: a row feed optical waveguide, a plurality of selectable, electrically actuated solid state optical switches, a pixel optical waveguide associated with each optical switch configured to receive the switched optical signal, and a solid state first vertical coupler associated with the pixel waveguide configured to direct the optical signal out of the plane of the optical chip. The optical chip can be connected with an electrical circuit board to control operation of the optical chip. A lens can be positioned to direct the light from a selected pixel along a specific direction such that a scan over an array of pixels covers a desired portion of the field of view.

Abstract: A single semiconductor device package that reduces electromagnetic coupling between elements of a semiconductor device embodied within the package is provided. For a dual-path amplifier, such as a Doherty power amplifier, an isolation feature that separates carrier amplifier elements from peaking amplifier elements is included within the semiconductor device package. The isolation feature can take the form of a structure that is constructed of a conductive material coupled to ground and which separates the elements of the amplifier. The isolation feature can be included in a variety of semiconductor packages, including air cavity packages and overmolded packages. Through the use of the isolation feature provided by embodiments of the present invention a significant improvement in signal isolation between amplifier elements is realized, thereby improving performance of the dual-path amplifier.

Abstract: A single semiconductor device package that reduces electromagnetic coupling between elements of a semiconductor device embodied within the package is provided. For a dual-path amplifier, such as a Doherty power amplifier, an isolation feature that separates carrier amplifier elements from peaking amplifier elements is included within the semiconductor device package. The isolation feature can take the form of a structure that is constructed of a conductive material coupled to ground and which separates the elements of the amplifier. The isolation feature can be included in a variety of semiconductor packages, including air cavity packages and overmolded packages. Through the use of the isolation feature provided by embodiments of the present invention a significant improvement in signal isolation between amplifier elements is realized, thereby improving performance of the dual-path amplifier.

Abstract: A single semiconductor device package that reduces electromagnetic coupling between elements of a semiconductor device embodied within the package is provided. For a dual-path amplifier, such as a Doherty power amplifier, an isolation feature that separates carrier amplifier elements from peaking amplifier elements is included within the semiconductor device package. The isolation feature can take the form of a structure that is constructed of a conductive material coupled to ground and which separates the elements of the amplifier. The isolation feature can be included in a variety of semiconductor packages, including air cavity packages and overmolded packages. Through the use of the isolation feature provided by embodiments of the present invention a significant improvement in signal isolation between amplifier elements is realized, thereby improving performance of the dual-path amplifier.

Abstract: The invention relates to an optical device including a passive high confinement waveguide, such as of silicon-rich silicon nitride, on an electro-optic substrate, like lithium niobate, optically coupled to a waveguide in the electro-optic substrate. A wide range of electro-optic devices are enabled by this high confinement waveguide structure, including: directional couplers, compact tap couplers, folded electro-optic devices, electro-optic modulators including ring resonators, electro-optic gratings. Further applications enabled by the present invention include hybrid passive planar lightwave circuits (PLC) integrated with electro-optically active waveguides, using the high confinement waveguide as an intermediary waveguide to transfer optical power between the passive and active components.

Abstract: A single semiconductor device package that reduces electromagnetic coupling between elements of a semiconductor device embodied within the package is provided. For a dual-path amplifier, such as a Doherty power amplifier, an isolation feature that separates carrier amplifier elements from peaking amplifier elements is included within the semiconductor device package. The isolation feature can take the form of a structure that is constructed of a conductive material coupled to ground and which separates the elements of the amplifier. The isolation feature can be included in a variety of semiconductor packages, including air cavity packages and overmolded packages. Through the use of the isolation feature provided by embodiments of the present invention a significant improvement in signal isolation between amplifier elements is realized, thereby improving performance of the dual-path amplifier.

Abstract: The invention relates to an optical device including a passive high confinement waveguide, such as of silicon-rich silicon nitride, on an electro-optic substrate, like lithium niobate, optically coupled to a waveguide in the electro-optic substrate. A wide range of electro-optic devices are enabled by this high confinement waveguide structure, including: directional couplers, compact tap couplers, folded electro-optic devices, electro-optic modulators including ring resonators, electro-optic gratings. Further applications enabled by the present invention include hybrid passive planar lightwave circuits (PLC) integrated with electro-optically active waveguides, using the high confinement waveguide as an intermediary waveguide to transfer optical power between the passive and active components.

Abstract: A coherent planar lightwave circuit (PLC) optical mixer chip is described comprising a matched pair of symmetrical four-coupler interferometers for in-phase and in-quadrature detection of two polarization components of light using a polarization diversity arrangement. The waveguide structure of the chip is symmetrical about two orthogonal central axes of the chip, whereby the effect of temperature gradients on the mixer is reduced. A light traveling from an input to an output of any of the two interferometers is cross-coupled by one of the two couplers it passes through, and is bar-coupled by the other of the two couplers, so as to compensate for polarization, wavelength, and manufacturing process dependence of bar-coupling with that of cross-coupling.

Abstract: An embodiment of a die assembly includes a flange, lip walls, and leads for electrical contact with one or more die mounted on the flange. The flange has first and second opposed flange surfaces and flange sidewalls extending between the surfaces. The lip walls have first and second opposed lip surfaces and lip sidewalls extending between the first and second lip surfaces. The lip sidewalls are positioned adjacent to the flange sidewalls. The leads, which have inboard end portions and outboard end portions, are configured to preserve a seating plane. The seating plane is spaced apart from a plane of the second flange surface. The inboard end portions of the leads are embedded in the lip walls, and extend from the seating plane upward through the lip walls toward the first lip surfaces. The outboard end portions are aligned substantially within the seating plane.

Abstract: A method and apparatus for monitoring spectral tilt uses an arrayed waveguide grating (AWG) to separate a multiplexed optical signal having a plurality of wavelength channels into a plurality of sub-bands, where each sub-band spans a different wavelength range and includes more than one wavelength channel. A photodetector array is provided to measure the optical power in each of the sub-bands, while control electronics calculate spectral tilt of the multiplexed optical signal using the measured optical power in each of the sub-bands. The spectral tilt monitor in accordance with the instant invention provides spectral resolution, increased monitoring speeds, and decreased manufacturing costs.

Abstract: An embodiment of a die assembly includes a flange, lip walls, and leads for electrical contact with one or more die mounted on the flange. The flange has first and second opposed flange surfaces and flange sidewalls extending between the surfaces. The lip walls have first and second opposed lip surfaces and lip sidewalls extending between the first and second lip surfaces. The lip sidewalls are positioned adjacent to the flange sidewalls. The leads, which have inboard end portions and outboard end portions, are configured to preserve a seating plane. The seating plane is spaced apart from a plane of the second flange surface. The inboard end portions of the leads are embedded in the lip walls, and extend from the seating plane upward through the lip walls toward the first lip surfaces. The outboard end portions are aligned substantially within the seating plane.

Abstract: The invention relates to an asymmetric Mach Zehnder Interferometer (MZI) having a reduced drive voltage, coupled to a compact low-loss arrayed waveguide grating (AWG) to provide a broader passband with low ripple. The integrated device has a compact stackable design for improved manufacturing yield. Inputs and outputs of the device are disposed in alignment on opposite sides of a silicon chip with the MZI having an opposite curvature to the AWG. To achieve this alignment, waveguide arms of the MZI are crossed without coupling between them before the optical signal is combined and coupled into the AWG.

Abstract: A coherent planar lightwave circuit (PLC) optical mixer chip is described comprising a matched pair of symmetrical four-coupler interferometers for in-phase and in-quadrature detection of two polarization components of light using a polarization diversity arrangement. The waveguide structure of the chip is symmetrical about two orthogonal central axes of the chip, whereby the effect of temperature gradients on the mixer is reduced. A light traveling from an input to an output of any of the two interferometers is cross-coupled by one of the two couplers it passes through, and is bar-coupled by the other of the two couplers, so as to compensate for polarization, wavelength, and manufacturing process dependence of bar-coupling with that of cross-coupling.

Abstract: The invention relates to an optical device including a passive high confinement waveguide, such as of silicon-rich silicon nitride, on an electro-optic substrate, like lithium niobate, optically coupled to a waveguide in the electro-optic substrate. A wide range of electro-optic devices are enabled by this high confinement waveguide structure, including: directional couplers, compact tap couplers, folded electro-optic devices, electro-optic modulators including ring resonators, electro-optic gratings. Further applications enabled by the present invention include hybrid passive planar lightwave circuits (PLC) integrated with electro-optically active waveguides, using the high confinement waveguide as an intermediary waveguide to transfer optical power between the passive and active components.

Abstract: A method and apparatus for monitoring spectral tilt uses an arrayed waveguide grating (AWG) to separate a multiplexed optical signal having a plurality of wavelength channels into a plurality of sub-bands, where each sub-band spans a different wavelength range and includes more than one wavelength channel. A photodetector array is provided to measure the optical power in each of the sub-bands, while control electronics calculate spectral tilt of the multiplexed optical signal using the measured optical power in each of the sub-bands. The spectral tilt monitor in accordance with the instant invention provides spectral resolution, increased monitoring speeds, and decreased manufacturing costs.

Abstract: A method and apparatus for monitoring spectral tilt uses an arrayed waveguide grating (AWG) to separate a multiplexed optical signal having a plurality of wavelength channels into a plurality of sub-bands, where each sub-band spans a different wavelength range and includes more than one wavelength channel. A photodetector array is provided to measure the optical power in each of the sub-bands, while control electronics calculate spectral tilt of the multiplexed optical signal using the measured optical power in each of the sub-bands. The spectral tilt monitor in accordance with the instant invention provides spectral resolution, increased monitoring speeds, and decreased manufacturing costs.

Abstract: A method is provided for manufacturing a semiconductor device from a substrate (200) having an active surface (204) and a non-active surface (206). The method comprises depositing a backing material (104) onto the non-active surface of the substrate (206) in a pattern (500), the pattern (500) having at least a first die section (210), a second die section (212) adjacent the first die section (210), and a strip (216) connecting the first die section (210) and the second die section (212), removing material from portions of the non-active surface of the substrate (206) on which the backing material (104) is not deposited to thereby partially separate the substrate (200) into a first die (236) and a second die (238) connected to one another by the strip (254) of the deposited backing material, and breaking the strip connector (254) to separate the first die (236) from the second die (238).

Abstract: A polarization compensated planar waveguide branch is disclosed having a planar optical trunk waveguide for transporting a linearly un-polarized optical signal having TE and TM modes. A planar optical branch waveguide, capable of supporting TE and TM modes is optically coupled to the trunk waveguide such that at least a portion of an optical signal propagating within the trunk waveguide will couple into the branch waveguide with an undesired imbalance, having stronger TM mode coupling than TE mode coupling for the at least the portion of the optical signal which couples into the branch waveguide from the trunk waveguide.

Abstract: A demultiplexer/multiplexer is disclosed wherein an arrayed waveguide grating having a reflector at an end includes selectable signal path blockers. The arrayed waveguide device has a common input/output port for launching radiation in the form of an input signal having n wavelengths therein and for receiving back via the reflector at the input/output port a selected channel of the input signal. In operation a multiplexed signal have n channels is launched therein and a selected channel is output for analysis or further processing.