Abstract: A circuit board apparatus for terminating shielded conductors having multiple different ground potential values is disclosed. In a signal interconnection region, a multi-layer laminated circuit board comprises a shield termination layer that is capacitively coupled to a separate ground reference layer by a dielectric layer. A signal layer is electrically isolated from both the ground reference layer and shield termination layer by a substrate. A shield of a shielded cable terminates at the shield termination layer of the interconnect region, and a signal conductor of the cable terminates at the signal layer. Buried capacitance is developed between the shield termination layer and the ground reference layer. As a result, RF emissions are minimized and an electrically safe termination of multiple ground sources is provided, without enlarging the surface area of an interconnection.